Senior RF Packaging Tech Lead — Wafer-to-Package Integration

QUALCOMM, Inc.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Qualcomm RF360 Singapore is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre-assembly, Cu pillar bumping, and die sort. You will drive development and integration of RF SiP packaging processes and lead technology transfer from development to high-volume manufacturing with global partners.

The role requires 10+ years in semiconductor packaging, strong cross‑functional leadership, and hands-on experience with wafer

Qualifications

• Senior technical specialist with end-to-end packaging technology ownership.

Responsibilities

• Operate as a senior technical lead in a global, cross-functional matrix, driving technology readiness, execution, and product timelines.

Job description

Qualcomm RF360 Singapore is seeking a senior technical specialist to own end-to-end packaging technology and product integration, including wafer pre-assembly, Cu pillar bumping, and die sort. You will drive development and integration of RF SiP packaging processes and lead technology transfer from development to high-volume manufacturing with global partners.

The role requires 10+ years in semiconductor packaging, strong cross‑functional leadership, and hands-on experience with wafer