Senior Package Design & Reliability QA Manager

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Micron Technology, Inc in Singapore seeks a Sr. Manager for Package Design/Development Quality Assurance. This role involves leading a specialized engineering team, ensuring the introduction of advanced package technologies, and addressing chip-package interaction risks. Candidates should have over 10 years of relevant experience, strong leadership skills, and in-depth knowledge of semiconductor package assembly. Micron offers a collaborative environment where you can influence technology advancement and drive innovation.

Qualifications

• 10+ years of experience in packaging technology, assembly engineering, or product quality.
• Ability to lead and develop senior technical engineers.
• Strong knowledge of package assembly and reliability standards.

Responsibilities

• Lead DDQA strategy for new package technology introductions.
• Define and oversee characterization and reliability test strategies.
• Drive early identification and mitigation of package-level reliability risks.

Skills

Leadership and team development

Semiconductor package assembly knowledge

Analytical skills

Collaboration across functions

Job description

Micron Technology, Inc in Singapore seeks a Sr. Manager for Package Design/Development Quality Assurance. This role involves leading a specialized engineering team, ensuring the introduction of advanced package technologies, and addressing chip-package interaction risks. Candidates should have over 10 years of relevant experience, strong leadership skills, and in-depth knowledge of semiconductor package assembly. Micron offers a collaborative environment where you can influence technology advancement and drive innovation.