Engineer , Pkg Reliability Singapore, Singapore Posted 13 hours ago

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 78,120 - 106,020; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Global Quality Package Reliability Engineer to own program quality across new products and designs.

You will lead package qualification activities, develop qualification plans, and guide release readiness based on reliability results. You will perform test planning, root cause analyses, and collaborate with internal teams and customers to ensure package reliability.

Qualifications

• Bachelor’s degree in engineering or related field with focus on microelectronics.
• 1–2 years in microelectronic packaging, quality or reliability engineering, or failure analysis.
• Strong understanding of reliability test methods and life-prediction techniques.
• Excellent problem-solving, communication, and cross-functional collaboration skills.

Responsibilities

• Lead and coordinate package qualification for new products and processes.
• Develop reliability test plans and screening methodologies.
• Conduct root-cause investigations and drive corrective actions.
• Communicate with internal teams and customers on quality and reliability.

Skills

Semiconductor packaging processes

Thermo-mechanical analysis

Reliability test methods

Statistical sampling

Root cause analysis

Communication in English

Project management

Backend manufacturing software

Education

Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field

Tools

8D CAR

FMEA

Life-prediction models

Manufacturing software systems

Job description

## Engineer , Pkg ReliabilitySingapore, SingaporeApply NowFind out how well you match with this jobJob IDJR102510**Our vision is to transform how the world uses information to enrich life for all.**Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.**Position Overview:** As a Global Quality (GQ) Package Reliability Engineer at Micron Technology Inc., you will be accountable for ensuring the quality and reliability of semiconductor packages across assigned product lines. This role encompasses end-to-end coordination of package qualification activities for new products, as well as for new designs, materials, or processes. You will provide recommendations on product release decisions based on comprehensive reliability test results.**Key Responsibilities:*** **New Product Qualification :** + Lead and coordinate package qualification efforts for new products and process introductions. + Develop and implement robust qualification plans for new technologies and product developments. + Provide recommendation on new product release readiness based on reliability assessment outcomes.* **Reliability Test Planning and Execution:** + Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues. + Recommend effective screening methodologies for quality-sensitive lots. + Maintain and improve monitoring systems to ensure ongoing package quality.* **Root Cause Analysis and Corrective Actions:** + Participate and drive in 8D problem-solving processes. + Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs. + Prepare and present technical reports for internal and external partners.* **Customer and Partner Engagement:** + Serve as a technical liaison for both internal teams and external customers regarding package-related to quality and reliability concerns. + Evaluate customer requests for alignment with Micron’s quality policies. + Provide technical expertise and support for customer inquiries and requirements.**Qualifications and Skills:*** Good knowledge of semiconductor package assembly processes and surface mount technology.* Good understanding of thermo-mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.* Proficiency in industry-standard reliability test methods, life prediction acceleration models, and statistical sampling.* Good analytical problem-solving abilities and project management skills.* Good written and verbal communication skills in English and digital literacy are vital.* Familiarity with backend manufacturing software systems.* Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR).* Self-motivated, meticulous, and capable of independent work and multi-cross functional team**Education and Experience:*** Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science) or related field.* Minimum 1- 2 years of experiences in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis**About Micron Technology, Inc.**We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life *for all*. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport\[e-mail]