Semiconductor Package Reliability Engineer (NPI)

Micron Technology, Inc; Singapore; On-site; SGD 70,000 - 90,000; Full time

Benefits offered by this job

Choice of medical, dental and vision plans

Robust paid time-off program

Paid holidays

Job summary

Micron Technology, Inc in Singapore is seeking a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages. You will coordinate package qualification activities for new products and provide recommendations on product release decisions based on reliability assessments.

The ideal candidate will have a background in engineering with experience in Micro Electronic Packaging, and possess strong analytical and problem-solving skills.

Qualifications

• 1–2 years of experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis.
• Good knowledge of semiconductor package assembly processes.

Responsibilities

• Lead and coordinate package qualification efforts for new products.
• Develop reliability test plans to evaluate risks.
• Participate in root cause investigations for failures.

Skills

Knowledge of semiconductor package assembly processes

Understanding of thermo-mechanical interactions

Proficiency in reliability test methods

Analytical problem-solving abilities

Good written and verbal communication skills

Familiarity with backend manufacturing software systems

Understanding of quality management tools

Self-motivated and meticulous

Education

Bachelor’s or Master’s in Engineering

Job description

Micron Technology, Inc in Singapore is seeking a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages. You will coordinate package qualification activities for new products and provide recommendations on product release decisions based on reliability assessments.

The ideal candidate will have a background in engineering with experience in Micro Electronic Packaging, and possess strong analytical and problem-solving skills.