Senior Process Engineer – Advanced Packaging & Thin Films

ASM; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

ASM in Singapore seeks a Senior Process Engineer to advance semiconductor process technologies through thin-film deposition and advanced packaging. You will drive DOE/RSM studies, develop W2W/D2W Hybrid bonding processes, mentor engineers, and collaborate with customers to demonstrate capabilities.

You will also contribute to materials characterization, publish findings, and support IP development. Travel up to 10% is expected as needed.

Qualifications

• Bachelor's degree or higher in a relevant field.
• Extensive hands-on experience in thin-film deposition and advanced packaging.
• Strong materials characterization skills.
• Experience with W2W/D2W Hybrid bonding is highly desirable.

Responsibilities

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands‑on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

Skills

Thin-film deposition

ALD

CVD

PECVD

Materials characterization

XPS

SIMS

RBS

AFM

XRR

XRD

TEM

SEM

Ellipsometry

Education

Bachelors degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Masters or PhD preferred

Tools

DOE

RSM

Ishikawa diagrams

Job description

ASM in Singapore seeks a Senior Process Engineer to advance semiconductor process technologies through thin-film deposition and advanced packaging. You will drive DOE/RSM studies, develop W2W/D2W Hybrid bonding processes, mentor engineers, and collaborate with customers to demonstrate capabilities.

You will also contribute to materials characterization, publish findings, and support IP development. Travel up to 10% is expected as needed.