Senior HBM Reliability Engineer: Test Strategy & Innovation

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 90,000 - 190,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking a senior reliability engineer to develop reliability stress tests, test flows and qualification plans for HBM products. You will work with Global Quality to drive qualification execution, root‑cause analysis and cross‑functional collaboration with Fab, HBM teams and Quality/Reliability.

You will bring a 5+ year background in semiconductor reliability, a degree in Electrical and Electronics Engineering, and strong data analysis, problem-solving and

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• 5+ years of experience in the semiconductor industry with product, testing, or reliability roles.
• Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.
• Strong problem-solving, root-cause analysis and exploration of solution spaces.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and commitment to quality.
• Ability to work effectively in team-based projects and contribute to shared goals.
• Flexible, eager to learn, and willing to take on diverse roles in a dynamic engineering environment.
• Responsible and accountable with a professional work ethic.
• Clear and effective written and spoken English communication skills.

Responsibilities

• Develop reliability stress tests, test flows, and test plans that cover all product reliability aspects.
• Work with the Global Quality team to define qualification plans, review and manage qualification execution progress, and resolve qualification gating issues.
• Drive down and achieve extrinsic reliability (Time0 and Field DPM) and intrinsic reliability through optimized manufacturing test flows and test strategy to meet critical KPIs.
• Root‑cause analysis and resolution of qualification (Qual) and RMA device issues, including electric failure analysis (EFA) and physical failure analysis (PFA).
• Recommend process conversions to fab teams to reduce cost, increase yields, and improve the yield, quality, reliability, and performance of HBM products.
• Communicate with Product Managers and Leads to manage risks associated with DPM process conversions, balancing innovation with stability and reliability.
• Promote innovation and drive changes that give Micron a technical advantage over competitors.
• Mentor and develop team members to support their growth and the organization’s success.
• Build project management skills within the team to ensure efficient execution and timely delivery of technological solutions.
• Make final decisions on risk analysis and project prioritization, directly influencing technological development direction.
• Collaborate with cross‑functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability.

Skills

Semiconductor experience

Root-cause analysis

CMOS technology

DRAM architecture

Python

JMP

Attention to detail

Teamwork

English communication

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field

Tools

Python

JMP

Job description

1100 Micron SemiAsiaOP Pte Ltd is seeking a senior reliability engineer to develop reliability stress tests, test flows and qualification plans for HBM products. You will work with Global Quality to drive qualification execution, root‑cause analysis and cross‑functional collaboration with Fab, HBM teams and Quality/Reliability.

You will bring a 5+ year background in semiconductor reliability, a degree in Electrical and Electronics Engineering, and strong data analysis, problem-solving and