Senior Engineer: Wafer-Level Packaging & Tech Integration

Nutanix; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Qualcomm is seeking a Process Development Engineer to drive end-to-end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies. You will ensure process readiness, manufacturability, and ramp-up through data‑driven decisions and collaboration with partners.

You will lead DOE studies, quality investigations, and cross-disciplinary technology integration projects while shaping process innovation and improving yield and reliability.

Qualifications

• Bachelor’s or Master’s degree in Engineering, Science, or related field.
• 3+ years of process integration engineering, technology development, or high-volume manufacturing experience.
• Experience with wafer-level packaging, cross-disciplinary projects, and data analytics.

Responsibilities

• Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.
• Co-own the technology transfer roadmap from pilot line to high-volume manufacturing.
• Drive root-cause analyses, DOE design, and ramp-readiness for manufacturing.

Skills

Cross-functional coordination

Data-driven decision making

DOE

SPC

Project management

Lean Six Sigma

Education

Bachelor’s or Master’s in Engineering/Science

Tools

PFMEA

PFCP

Job description

Qualcomm is seeking a Process Development Engineer to drive end-to-end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies. You will ensure process readiness, manufacturability, and ramp-up through data‑driven decisions and collaboration with partners.

You will lead DOE studies, quality investigations, and cross-disciplinary technology integration projects while shaping process innovation and improving yield and reliability.