Senior Engineer, Process Integration, NAND, NTI

micron semiconductor asia operations pte. ltd.; Singapore; On-site; SGD 100,000 - 140,000; Full time

Job summary

Micron Technology Inc. in Singapore seeks a Senior/Principal NAND Module Process Integration Engineer to design, develop, and implement innovative process solutions for next‑gen 3D NAND yield and quality, balancing cost and performance within tight timelines.

You will lead cross‑functional teams to address module deficiencies, refine CSPEC criteria, and coordinate site activities to fund experiments and manufacturing transfers, while driving AI-enabled improvements across projects.

Qualifications

• Passion for semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication and cross-functional teamwork skills.
• Committed to quality, collaboration, and continuous improvement.
• Self-motivated and able to work in a demanding, dynamic environment.
• Willingness to travel for extended periods to the US for joint R&D work.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps; lead cross-functional teams to address issues and improve process flows.
• Develop or redefine CSPEC criteria for optimal product performance and drive capability
• Coordinate site activities to secure funding for experiments and transfers; communicate decisions to R&D, Product Engineering and Manufacturing partners
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types; establish Proof of Concept for future tech nodes
• Lead quarterly yield summits and monthly program reviews to summarize problems, actions, and align teams
• Assist in transferring new technology from R&D to manufacturing; support ramp-up and qualification
• Leverage AI to streamline workflows, optimize processes, and enable data-driven decision making across projects

Skills

Data analysis

Problem solving

Process integration optimization

Cross-functional teamwork

Communication

Education

BS/MS/PhD in Electrical Engineering or related

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Senior/Principal NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability

• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability

• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners

• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility

• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams

• Assist in the transfer of new technology from R&D to manufacturing

• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

• Artificial Intelligence
  Using, applying and leveraging AI, identify opportunities to streamline workflows, optimize processes, and support innovation by incorporating AI-driven solutions and enabling data-driven decision making across projects and teams.

Successful candidates for this position,

Must have:

• Passion in semiconductor technology and innovation

• Adept at data analysis, problem-solving, and process integration optimization

• Excellent communication skills and ability to work in cross-functional teams

• Committed to quality, collaboration, and continuous improvement

• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field

• Proficiency in ing/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc.

• Minimum of 3 years of experience in the semiconductor industry in the areas of Process Integration and Yield Enhancement

• Ability to develop a strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms

• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable

• Exposure to R&D (such as HKMG) and transfer/manufacturing is desirable