Staff/ Principal Engineer, CMOS Process Integration, NTI

Micron Technology; Singapore; Presencial; SGD 70 000 - 90 000; Tempo integral

Resumo da oferta

Micron Technology is looking for a Staff/Principal NAND CMOS Module Process Integration Engineer for its Singapore R&D Department. The role involves designing innovative solutions to improve yield and quality for 3D NAND products. Candidates must possess at least a bachelor's degree in relevant fields and a passion for semiconductor technology.

The position requires excellent communication skills for teamwork and offers opportunities for travel to the U.S. for R&D collaboration.

Qualificações

• 3+ years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
• Understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge of NAND process flow and common yield & reliability issues.

Responsabilidades

• Identify and quantify key module deficiencies and technology gaps.
• Develop or redefine CSPEC criteria for product performance.
• Coordinate activities to secure funding for experiments and communicate decisions.
• Evaluate and implement new integration schemes for alpha and derivative parts.
• Lead yield summits and summarize complex problems.

Conhecimentos

Data analysis

Problem-solving

Process integration optimization

Excellent communication

Team collaboration

Formação académica

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or related field

Ferramentas

Python

SolidWorks

Tableau

Power BI

Descrição da oferta de emprego

Position: Staff/Principal NAND CMOS Module Process Integration Engineer (Singapore R&D Department)

We are seeking an engineer to design, develop, integrate, and implement innovative and effective process solutions to improve next‑generation 3D NAND product yield and quality.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps. Lead cross‑functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing.
• Contribute to ensuring a successful ramp‑up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Must Have

• Passion in semiconductor technology and innovation.
• Adept at data analysis, problem‑solving, and process integration optimization.
• Excellent communication skills and ability to work in cross‑functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self‑motivated, self‑governing, and proven in a demanding & dynamic environment.
• Ability to travel for extended periods to the U.S. for collaborative R&D work.

Requirements

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Minimum of 3 years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end‑to‑end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In‑depth knowledge and direct experience with non‑volatile memories (NAND) along with a good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable.
• Exposure to R&D such as HKMG is desirable.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail].

Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.