Senior Engineer/Engineer,Thin Film Equipment

Vanguard International Semiconductor Corporation (VIS); Singapore; Vor Ort; SGD 70.000 - 110.000; Vollzeit

Zusammenfassung

Vanguard International Semiconductor Corporation (VIS) in Singapore seeks an experienced Equipment Maintenance Engineer to own and improve key KPIs across quality, uptime, and cost. You will sustain equipment performance, coordinate with process and manufacturing teams, and drive a robust preventive maintenance program.

You will lead a small team, mentor staff, and document corrective actions while applying FMEA insights and SPC analysis (e.g., JMP).

Qualifikationen

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering is required.
• Minimum 3 years of relevant experience in wafer fabrication and handling Thin Film Equipment (CVD/PVD).
• Strong interpersonal, communication and documentation skills.
• High integrity with leadership abilities to lead and coach a team.

Aufgaben

• Own, maintain and improve Quality, Uptime and Cost indices.
• Sustain equipment KPI and drive continuous improvements to performance.
• Monitor and control equipment performance indices; optimize PM procedures.
• Coordinate with process and manufacturing Engineers to meet module objectives.
• Manage logistics for parts to prevent downtime during equipment failures.
• Control maintenance expenditure without compromising quality output.
• Drive continuous improvement of equipment KPI in quality, uptime and cost.
• Plan and implement an effective Preventive Maintenance program.
• Coach and mentor subordinates and provide performance feedback.
• Document Corrective Action and Best Known Methods for ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• Become the technical Expert for the respective machine specialization.
• Monitor and analyze SPC charts; use JMP to analyze engineering experiments.
• Know how to use measurement instruments for data collection.
• Understand FMEA and generate FMEA analyses to identify top risks.
• Create PROMIS DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup to acceptance.
• Wafer scrap reduction awareness.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure; guide Junior Engineers.
• Self-audit and update specifications to meet TS16949 Quality standards.
• Set expectations and carry out performance appraisals for Technicians or AE as instructed.

Kenntnisse

Equipment maintenance

Preventive maintenance

Quality improvement

Uptime optimization

Leadership

Data analysis

SPC

JMP

FMEA

Start-up coordination

Ausbildung

Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Tools

PROMIS DC OP

SPC charts

Measurement instruments

Jobbeschreibung

• To own, maintain and improve the following indices: Quality, Uptime and Cost.
• Sustain equipment KPI and make continuous improvements to enhance the performance.
• Monitor and control equipment performance indices. Optimize PM procedures to make it more effective and efficient.
• Coordinate with both process and manufacturing Engineers to ensure work is carried out efficiently to meet module objectives.
• Manage the logistics for parts so as to prevent prolonged uptime losses in the case of equipment failure.
• Manage the expenditure allocated for equipment maintenance without compromising on quality output.
• Continuous improvement of equipment KPI in terms of quality, uptime and costs.
• Plan and implement an effective Preventive Maintenance program on equipment.
• Coach and Mentor subordinates to ensure that skill level and knowledge are up to date, and continuously give feedback on their work performance.
• Document Corrective Action and Best Known Methods, and Fan it out to all for maximum ROI and learning.
• Participate in CIP programs to optimize equipment utilization and cost of maintenance.
• Become the technical Expert for the respective machine specialization.
• Monitor and analyze SPC charts. Know how to use JMP to analyze engineering experiments.
• Know how to use measurement instruments effectively in data collection.
• Understand FMEA and be able to generate FMEA analysis for new tool. Able to utilize it to identify tool weaknesses and derive the top 3 to 5 risk factors.
• Able to create PROMIS DC OP and SPC charts.
• Coordinate new equipment start-up to support production, from facilities hookup, vendor startup, to acceptance of equipment for production.
• Wafer scrap reduction awareness and mindset.
• Follow up on SPSR, MRB, 8D, TECN, and ECN documentation for closure of issues / events. Provide guidance to Junior Engineers.
• Self audit and update specifications to meet TS16949 Quality Standard requirements.
• Set Expectation and carry out performance appraisal for Technician or AE as instructed by Section Manager.

Requirements:

• Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
• Min 3 years of relevant work experience Wafer fabrication and experience in handling Thin Film Equipment (CVD/PVD).
• Good team player with good interpersonal, communication and written skills.
• Strong logical thinking capability and good analytical skill.
• High level of integrity with strong leadership attributes to lead and coach a team.
• Highly committed with good ownership and accountability.
• Able to adapt in a fast pace environment and work under pressure.