Senior CMP Process Engineer, 3D NAND & AI-Driven Innovation

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 140,000 - 220,000; Full time

Job summary

Micron Technology, Inc. is seeking a Staff/Principal Engineer to lead CMP process development for next-generation 300mm NAND.

You will own process roadmaps, work with process integration and related areas, and drive innovations to improve yield and reliability across multiple memory nodes. The role emphasizes collaboration with global teams, mentoring, and applying cutting-edge metrology and AI-assisted insights to optimize CMP workflows.

Qualifications

• Hands-on CMP equipment operation including AMAT (LKP) and EBARA-300X.
• Experience with dielectric/metals CMP for 3D NAND or memory tech.
• Familiarity with optical metrology, profilometry, slurries, conditioners, pads.

Responsibilities

• Develop and optimize CMP processes to meet 3D NAND yield goals.
• Lead experiments to widen process margins and evaluate manufacturability.
• Collaborate with vendors to meet integration requirements for next nodes.
• Design advanced process monitoring and control methods.
• Mentor hires and drive multi-functional projects; contribute to IP.

Skills

CMP equipment operation

Optical metrology

Profilometry

Polishing slurries

Polishing pads

Process integration

3D NAND memory CMP

Education

Masters/PhD or Bachelors with significant CMP experience

Job description

Micron Technology, Inc. is seeking a Staff/Principal Engineer to lead CMP process development for next-generation 300mm NAND.

You will own process roadmaps, work with process integration and related areas, and drive innovations to improve yield and reliability across multiple memory nodes. The role emphasizes collaboration with global teams, mentoring, and applying cutting-edge metrology and AI-assisted insights to optimize CMP workflows.