Senior CMOS Process Integration Engineer – 3D NAND

micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a Staff/Principal NAND CMOS Module Process Integration Engineer to design, develop, and implement innovative process solutions that improve next-generation 3D NAND product yield and quality within cost and schedule constraints.

You will lead cross-functional teams across R&D, product engineering, and manufacturing, advance integration schemes for new NAND technologies, and help transfer technology from development to production while ensuring ramp‑up

Qualifications

• Bachelor/Master/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, or Material Science or related field.
• Minimum of 3 years in semiconductor process integration and yield enhancement.
• Experience with NAND/NVM technologies and failure analysis is desirable.
• Exposure to HKMG or advanced process nodes is a plus.

Responsibilities

• Identify module deficiencies and technology gaps; lead cross-functional teams to address issues.
• Define CSPEC criteria for product performance and drive process capability.
• Coordinate site activities to secure funding for experiments and conversions.
• Develop integration schemes for alpha/derivative part types and establish proof of concept for future tech nodes.
• Lead quarterly yield reviews to align R&D, manufacturing, and leadership.

Skills

Data analysis

Problem solving

Cross-functional teams

Communication

Quality minded

Self-motivated

Travel availability

Education

Electrical Engineering

Microelectronics

Chemical Engineering

Material Science

MS/PhD preferred

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Micron Technology, Inc. in Singapore seeks a Staff/Principal NAND CMOS Module Process Integration Engineer to design, develop, and implement innovative process solutions that improve next-generation 3D NAND product yield and quality within cost and schedule constraints.

You will lead cross-functional teams across R&D, product engineering, and manufacturing, advance integration schemes for new NAND technologies, and help transfer technology from development to production while ensuring ramp‑up