NAND Process Integration Lead — Yield & Quality

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore is seeking a Senior NAND Module Process Integration Engineer to design and implement next-gen 3D NAND process solutions ensuring high yield and quality.

You will lead cross-functional teams, define CSPEC criteria, coordinate funding for experiments, and transfer technology from R&D to manufacturing, including AI-enabled enhancements to improve efficiency and outcomes.

Qualifications

• BS, MS/PhD in Electrical Eng, Microelectronics, Chemical Engineering, Material Science or related field.
• Proficiency in Python, SolidWorks, Tableau, Power BI, etc. is desirable
• Minimum of 3 years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
• Ability to develop a strong holistic end-to-end understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms
• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable
• Exposure to R&D and transfer/manufacturing is desirable

Responsibilities

• Identify and quantify module deficiencies; lead cross-functional teams to address issues and improve current process flows.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities for manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and communicate decisions to R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types; establish proof of concept for future tech nodes.
• Assist in the transfer of new technology from R&D to manufacturing.
• Contribute to ramp-up and qualification; support transfer, documentation, and training of module fundamentals into manufacturing.
• Integrate AI-assisted tools and insights to improve efficiency, quality, or effectiveness while complying with standards.
• Contribute to continuous improvement by identifying, testing, and sharing AI-enabled enhancements within scope

Skills

Data analysis

Problem solving

Process integration

Cross-functional collaboration

Communication skills

Self-motivated

Travel readiness

Education

BS in Electrical Engineering or related field

MS/PhD in Electrical Engineering or related field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Micron Semiconductor Asia Operations Pte. Ltd. in Singapore is seeking a Senior NAND Module Process Integration Engineer to design and implement next-gen 3D NAND process solutions ensuring high yield and quality.

You will lead cross-functional teams, define CSPEC criteria, coordinate funding for experiments, and transfer technology from R&D to manufacturing, including AI-enabled enhancements to improve efficiency and outcomes.