Engineer - Test Process (WLCSP)

ASE Singapore Pte Ltd; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

ASE Singapore Pte Ltd is seeking a seasoned engineer to support production across key semiconductor processes such as Taping, Backgrind, Wafer Mounting, and Laser operations. You will drive device introductions, optimize recipes, and ensure smooth line performance.

The role requires hands-on tool experience, strong quality-methodology knowledge (8D, FMEA, Control Plans, SPC), and meticulous documentation for audits. Join a team focused on reliability, safety, and continuous improvement.

Qualifications

• Bachelor's degree in Engineering or related technical discipline.
• 3+ years of experience in a semiconductor manufacturing environment.
• Hands-on experience operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.

Responsibilities

• Support production operations across Taping, Backgrind, Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and OCAPs.
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Skills

Process engineering

Troubleshooting

Quality tools

SOP compliance

Continuous improvement

Documentation

Education

Bachelor's Degree in Engineering

Tools

Taping equipment

Backgrind

Lasermark

Wafer Mount

Laser Groove

Dicing

PSI machinery

Job description

Responsibilities

• Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Requirements

• Bachelor's Degree in Engineering or a related technical discipline.
• 3+ years of experience within a semiconductor manufacturing environment.
• Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.