Senior Associate Engineer (Semiconductor Machine Equipment)

MCI CAREER SERVICES PTE. LTD.; Singapore; Presencial; SGD 43 000 - 51 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

AWS

Performance Bonus

Shift Allowances

Resumo da oferta

MCI CAREER SERVICES PTE. LTD. seeks a skilled engineer to calibrate, test and validate semiconductor packaging equipment, ensuring compliance with manufacturing specs and quality standards.

You will diagnose issues and implement corrective actions to improve yield and efficiency. The role requires a Diploma or Degree in Materials Science, Electrical, Mechanical Engineering or related field, with 3+ years in semiconductor or related technical environments.

Qualificações

• Strong analytical and systematic problem-solving skills.
• Experience with statistical analysis is a plus (DOE, JMP or Minitab).
• Proficiency in Excel and data analysis is expected.

Responsabilidades

• Perform machine calibration, setup, testing and validation to meet specs and quality standards.
• Diagnose and troubleshoot manufacturing issues, implementing corrective actions to improve yield and cycle time.
• Support process engineers in developing inspection protocols, recipes, tooling and procedures.

Conhecimentos

Analytical skills

Problem-solving

Formação académica

Diploma or Degree in Materials Science, Electrical, Mechanical Engineering

Ferramentas

Excel

JMP

Minitab

Descrição da oferta de emprego

Job Highlights

Located at Serangoon North, Singapore

Up to S$4,200

Working Days: 5 or 6 days per week (based on shift arrangement)

Benefits: AWS, Performance Bonus & Shift Allowances

Working Hours

• Initial Training Period (Approximately 1-3 Months): Normal Shift: 8:30 AM - 5:30 PM
• After Training (Based on Operational Requirements): Shift 2: 2:45 PM - 11:15 PM
• After Training (Based on Operational Requirements): Shift 3: 10:45 PM - 7:15 AM

Shift allowances are provided according to the assigned shift.

Responsibilities

• Perform machine calibration, setup, testing and performance validation on semiconductor packaging equipment to ensure compliance with manufacturing specifications and quality standards.
• Diagnose and troubleshoot assembly and manufacturing process issues, implementing corrective actions to improve first-pass yield, equipment performance and production cycle time.
• Support Process Engineers in developing and qualifying inspection protocols, process recipes, tooling and manufacturing processes, including updating work instructions and procedures.
• Verify the availability of manufacturing fixtures, jigs and technical documentation while ensuring accurate test data recording, quality reporting and continuous process improvement.

Skills/Experience Required

• Diploma or Degree in Materials Science, Electrical, Mechanical Engineering or a related engineering discipline.
• At least 3 years of relevant experience in semiconductor manufacturing, equipment engineering, process engineering or a related technical environment.
• Strong analytical and systematic problem-solving skills, with knowledge of statistical analysis, Design of Experiments (DOE), JMP or Minitab being advantageous.
• Experience with semiconductor equipment interfaces, machine calibration, process development or advanced packaging technologies such as Die Attach, Thermocompression Bonding (TCB), Fan-Out Wafer Level (FOWL) or Flip Chip (FC) is an advantage.
• Proficiency in Microsoft Excel and technical data analysis, with the ability to work during normal training hours and subsequently on assigned afternoon or night shifts.

Applicants who possess relevant experience for the above responsibilities are most welcome to apply. If you do not possess the above experience, your application will still be considered on individual merits and you may be contacted for other opportunities.