Our client is a global leader in the design and manufacture of semiconductor assembly equipment.
Job Details:
Shift 1 : 6:45am – 3:15pm
Shift 2 : 2.45pm – 11:15pm ($15 /Shift)
Shift 3 : 10:45pm – 7:15am ($25 /Shift)
Job Description:
- To perform machine performance validation on semiconductor packaging equipment through machine calibration, setup and testing based on defined work procedures.
- To provide level 1 support to identify, diagnose and resolve assembly process related problems to achieve defined first pass yield and manufacturing cycle-time.
- To support Process Engineer to develop and qualify manufacturing inspection protocols (metrology equipment qualification or integrity test definition) to ascertain machine performance and integrity.
- To support Process Engineer in development and enhancement of process recipes, process tooling or manufacturing processes; inclusive of updating and enhancing of work procedures.
- To ensure and validate all necessary fixtures, jigs, drawings, and work instruction are available for manufacturing processes.
- To ensure timely input of manufacturing test data and support report output on machine quality.
- Perform other duties as assigned.
Qualifications:
- 2 to 5 years experience in semiconductor industry with equipment maintenance or testing engineering in a manufacturing facility, preferably in Electrical Wafer Sorting (EWS), Final Testing and Burn in testing of back-endoperations.
- Possess strong interest in statistical analysis skillset with demonstrated ability to conduct design-of-experiment. Proficient in JMP or Minitab would be a plus
- Experience in handling semiconductor capital equipment GUI and hands-on experience in process development of advanced packaging processes (die attach, TCB, FOWL or FC) will be advantageous
- Ability to work on shift timing (2nd and 3rd).
**We regret to inform that only shortlisted candidates would be notified.