Senior Advanced Packaging Architect for High-Power HPC Chips

Bitdeer (NASDAQ: BTDR); Singapore; On-site; SGD 180,000 - 240,000; Full time

Benefits offered by this job

Welfare benefits

Training and mentoring

Job summary

Bitdeer is seeking a Staff / Principal Advanced Packaging Engineer to lead packaging architecture, strategy, and high-volume manufacturing for next-generation HPC silicon.

You will define packaging roadmaps, lead cross-functional chip-package-board co-design, and ensure scalable production for large-die, high-power devices.

This hands-on leadership role requires 8+ years in packaging, deep SI/PI knowledge, and the ability to drive projects from concept through production.

Qualifications

• Bachelor’s degree and 8+ years in advanced packaging.
• Experience bringing high-layer-count FCBGA to production.
• Strong coupling of design, process, and manufacturing.

Responsibilities

• Define packaging architecture and technology strategy.
• Lead cross-functional chip-package-board co-design.
• Govern packaging development with schedules and quality standards.
• Oversee NPI to mass production and issue resolution.
• Collaborate with suppliers to assess capabilities and risks.

Skills

Advanced semiconductor packaging

Package architecture

System-level Chip–Package–Board co‑设计

Thermal & mechanical reliability

SI/PI analysis

Vendor management

Cross-functional leadership

Education

Bachelor's degree in Microelectronics / Semiconductor Engineering / Electrical Engineering

Tools

Cadence APD

Allegro

Job description

Bitdeer is seeking a Staff / Principal Advanced Packaging Engineer to lead packaging architecture, strategy, and high-volume manufacturing for next-generation HPC silicon.

You will define packaging roadmaps, lead cross-functional chip-package-board co-design, and ensure scalable production for large-die, high-power devices.

This hands-on leadership role requires 8+ years in packaging, deep SI/PI knowledge, and the ability to drive projects from concept through production.