Semiconductor Process Engineer Intern – AI-Driven Packaging

Applied Materials; Singapore; On-site; SGD 20,000 - 27,000; Full time

Job summary

Applied Materials in Singapore offers a Process Engineer Intern role to support development, characterization, and optimization of thin film deposition for advanced packaging. You will collaborate with process, hardware, and materials engineers to run experiments and analyze data.

This hands-on internship covers semiconductor manufacturing equipment, DOE methodologies, statistical analysis, and cross-functional collaboration toward next-generation devices.

Qualifications

• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin film deposition, plasma processing, or surface science.
• Experience with experimental design and data analysis.
• Strong problem-solving and analytical skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively in a team environment.

Responsibilities

• Design and execute process engineering experiments.
• Develop and optimize CVD, PECVD, PEALD, or related thin film deposition processes.
• Perform wafer processing and experimental runs according to defined procedures.
• Analyze process results and identify opportunities for performance improvement.
• Collect and analyze process and metrology data.
• Characterize film properties including thickness, uniformity, refractive index, stress, composition, surface roughness, and electrical properties.

Skills

Experimental design

Data analysis

Problem solving

Communication

Team collaboration

Job description

Applied Materials in Singapore offers a Process Engineer Intern role to support development, characterization, and optimization of thin film deposition for advanced packaging. You will collaborate with process, hardware, and materials engineers to run experiments and analyze data.

This hands-on internship covers semiconductor manufacturing equipment, DOE methodologies, statistical analysis, and cross-functional collaboration toward next-generation devices.