Advanced Packaging Intern: Process Integration

Applied Materials South East Asia; Singapore; On-site; SGD 11,000 - 17,000; Full time

Job summary

Applied Materials in Singapore is seeking an Intern / Student to join the Process Integration team. This hands-on program focuses on advanced packaging building blocks, including redistribution layers (RDL), damascene copper structures, wafer-level interconnects, and hybrid bonding processes.

You will develop process flow, participate in experimental design, analyze data, characterize defects, and correlate parameters with electrical and physical performance.

Responsibilities

• Process flow development
• Experimental design
• Data analysis
• Defect characterization
• Correlation of process parameters to electrical and physical performance metrics
• Hands-on exposure to semiconductor fabrication processes and advanced packaging integration challenges

Job description

Applied Materials in Singapore is seeking an Intern / Student to join the Process Integration team. This hands-on program focuses on advanced packaging building blocks, including redistribution layers (RDL), damascene copper structures, wafer-level interconnects, and hybrid bonding processes.

You will develop process flow, participate in experimental design, analyze data, characterize defects, and correlate parameters with electrical and physical performance.