Intern — Advanced Packaging Process Engineering

ASM; Singapore; On-site; SGD 13,000 - 22,000; Full time

Job summary

ASM Singapore offers an internship in Advanced Packaging R&D to develop surface preparation solutions for hybrid bonding, enabling high-speed communication with low power loss.

You will work with experienced researchers to design experiments, validate processes, and establish best-known methods for integration, while building hands-on skills in metrology and process equipment.

The program emphasizes collaboration across teams and aims to accelerate your growth in semiconductor technology.

Qualifications

• Pursuing a degree in a relevant engineering field.
• Strong interest in semiconductor manufacturing and packaging tech.
• Ability to analyze technical data and communicate findings clearly.
• Teamwork and problem-solving skills.

Responsibilities

• Develop advanced surface preparation solutions for hybrid bonding interconnects.
• Define process specs to target bonding strength, defectivity, uniformity, and performance.
• Perform process validation and establish BKMs for integration.
• Design, execute, and analyze experiments to evaluate process performance.
• Collaborate with Advanced Packaging R&D on technology development.
• Present findings and recommendations based on data.

Skills

Analytical thinking

Teamwork

Problem-solving

Communication

Education

Bachelor's/Master's in Electronics Eng, Materials Science, Mechanical Eng, Systems Eng or related

Job description

ASM Singapore offers an internship in Advanced Packaging R&D to develop surface preparation solutions for hybrid bonding, enabling high-speed communication with low power loss.

You will work with experienced researchers to design experiments, validate processes, and establish best-known methods for integration, while building hands-on skills in metrology and process equipment.

The program emphasizes collaboration across teams and aims to accelerate your growth in semiconductor technology.