Product Strategy Intern: Semiconductors & Packaging

Applied Materials South East Asia; Singapore; On-site; SGD 20,000 - 27,000; Full time

Job summary

Applied Materials South East Asia in Singapore is seeking an intern/student to support market intelligence and product-planning efforts. You will analyze industry trends from SEMICON and publications, map market positions, and help collect customer requirements from external resources, product managers, and account teams.

You will identify pain points in advanced packaging processes, align requirements with existing capabilities, and contribute to deliverables such as the Customer Requirement

Qualifications

• Experience in analyzing industry trends from publications and public sources.
• Ability to map market positions and identify growth opportunities.
• Experience collecting and categorizing customer requirements from multiple sources.
• Ability to analyze pain points in advanced packaging processes such as thermal dissipation and 3D integration.
• Capability to align requirements with existing product capabilities.

Responsibilities

• Analyze industry trends from SEMICON, ECTC, IEEE publications, Yole, TechInsights, and public earnings calls.
• Map current market positions and identify opportunities to grow.
• Collect and categorize customer requirements from external resources, product managers and account teams.
• Analyze pain points in advanced packaging processes, such as Thermal dissipation, Via-last integration, 3D Heterogenous integration, etc
• Map requirements against existing product capabilities.

Skills

Market analysis

Industry research

Requirements gathering

Stakeholder collaboration

Job description

Applied Materials South East Asia in Singapore is seeking an intern/student to support market intelligence and product-planning efforts. You will analyze industry trends from SEMICON and publications, map market positions, and help collect customer requirements from external resources, product managers, and account teams.

You will identify pain points in advanced packaging processes, align requirements with existing capabilities, and contribute to deliverables such as the Customer Requirement