Semiconductor Process Engineer Intern: Film Deposition

Applied Materials; Singapore; On-site; SGD 13,000 - 20,000; Full time

Job summary

Applied Materials in Singapore is seeking a Process Engineer Intern to support development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications. You will collaborate with process, hardware, and materials engineers to conduct experiments and analyze data, contributing to new technology development for next-generation devices.

This internship offers hands-on exposure to semiconductor manufacturing equipment, process development

Qualifications

• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin film deposition, plasma processing, or surface science.
• Experience with experimental design and data analysis.
• Strong problem-solving and analytical skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively in a team environment.

Responsibilities

• Assist engineers in designing and executing process engineering experiments.
• Support development and optimization of CVD, PECVD, PEALD, or related thin film deposition processes.
• Perform wafer processing and experimental runs according to defined procedures.
• Analyze process results and identify opportunities for performance improvement.
• Collect and analyze process and metrology data.
• Characterize film properties including thickness, uniformity, refractive index, stress, composition, surface roughness, and electrical properties.
• Utilize statistical methods and data visualization tools to identify trends and correlations.
• Film characterization and integration test on AMAT internal test vehicle.
• Support troubleshooting of process and equipment-related issues.
• Participate in structured root cause analysis activities.
• Document findings and propose corrective actions.
• Maintain accurate experimental records and engineering logs.
• Prepare technical reports and presentations summarizing findings.
• Present project progress and final internship results to engineering leadership.
• Work with Process, Hardware, Manufacturing, and Product Engineering teams.
• Participate in technical discussions and project review meetings.
• Support customer-focused development activities where appropriate.
• Explore preferred project areas such as low-temperature dielectric deposition, advanced packaging materials development, and wafer bonding.

Skills

Semiconductor processes

Experimental design

Data analysis

Problem solving

Communication skills

Teamwork

Job description

Applied Materials in Singapore is seeking a Process Engineer Intern to support development, characterization, and optimization of thin film deposition processes for advanced semiconductor packaging applications. You will collaborate with process, hardware, and materials engineers to conduct experiments and analyze data, contributing to new technology development for next-generation devices.

This internship offers hands-on exposure to semiconductor manufacturing equipment, process development