Optical Bonding Scientist: D2W/W2W & Metasurfaces

A*STAR - Agency for Science, Technology and Research

Singapore

On-site

SGD 90,000 - 130,000

Full time

14 days+

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Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a highly motivated Scientist to advance heterogeneous integration and advanced packaging in the Flat Optics Department. You will develop D2W bonding processes for optoelectronic devices including metasurfaces.

You will collaborate with cross-disciplinary teams, contribute to IP through disclosures and patents, and support translational research with industry partners to push cutting-edge optical technologies forward.

Qualifications

Ph.D. in Physics, Materials Science, Photonics, Electrical Engineering or a related field.
Advanced packaging, specifically die-to-wafer, wafer-to-wafer, or hybrid bonding.
Understanding of bond interface physics, alignment/overlay fundamentals.
Strong analytical, experimental, and problem-solving skills.
Good team player who can collaborate with industry and academic partners.

Responsibilities

Develop die-to-wafer bonding processes (surface preparation, plasma activation, high-accuracy placement).
D2W, W2W bonding of optical structures with cameras and micro-LED displays.
Electrical testing of devices, and optimization of process to improve yield and alignment precision.
Work with equipment and material team to develop bonding methods.
Contribute to intellectual property generation through invention disclosures and patent applications.
Support translational research and collaborations with industry partners.