Scientist (Multi Chiplet Heterogeneous Integration and High speed IO designer (SIP)), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a skilled multi-physics modelling and PDK development engineer. The candidate will leverage their PhD in Electrical or Computer Engineering and 5+ years of relevant experience to develop advanced packaging PDK interconnect models and co-simulation frameworks. Responsibilities include collaboration with design teams and applicability of AI/ML algorithms in advanced packaging. Join a dynamic environment to push the boundaries of technology.

Qualifications

• 5 years of relevant experience in Process Design Kits (PDK).
• Understanding of advanced packaging, RF interconnects, and signal integrity.
• Experience in multi-physics modelling approaches and AI/ML algorithms.

Responsibilities

• Collaborate with cross-functional design teams to understand modelling requirements.
• Develop accurate PDK components using multi-physics methods.
• Investigate and expand AI/ML application in advanced packaging design.

Skills

Multi-physics modelling

Machine learning regression

Programming in Python

Signal/power integrity

Thermal flow analysis

Education

PhD in Electrical or Computer Engineering

Tools

SKILL

Python

C/C++

Job description

Job Description

We are seeking a highly skilled multi-physics modelling and Process Design Kit (PDK) development engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), will focus on converting 2.5D/3D/3.5D chiplet based System in Package design and integration needs into advanced packaging PDK interconnect models, advanced co-simulation frameworks and reference flows. The successful candidate will play a crucial role in developing accelerating simulation, analysis and modelling towards design enablement of state‑of‑the‑art advanced packaging.

Key Responsibilities

• Collaborate with cross‑functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs and modelling requirements.
• Evaluate and develop accurate PDK components using classical methods, multi‑physics methods such as reduced order models, and probabilistic methods using applicable AI/ML algorithms or PINN.
• Participate and perform benchmark and Design of Experiments using measured tapeout data from test package of 2.5D Interposer, 3D Hybrid Bonding or 3.5D packages.
• Investigate and expand use of AI / ML algorithms within the advanced package design flow. Perform comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis.
• Develop and maintain PDK including installation, Design Rule Manual, automation and reference flows

Required Qualifications

• PhD with 5 years, relevant experience in handling various aspects of Process Design Kits (PDK)
• Understanding of advanced packaging / high speed or RF interconnects / I‑O PHY, signal/power integrity, thermal flow, package stress and yield in advanced packaging.
• Experience in any multi‑physics modelling approaches, machine learning regression, use of language models, reduced order models.
• Programming and scripting skills in one or more of the following: SKILL, ADL, Python, Perl, C/C++, TCL, or AEL.

Preferred Qualifications

• Ability to research, develop and implement AI/ ML algorithms using industry‑standard open‑source tools/methodologies.
• Strong problem‑solving aptitude and creative thinking to address technical challenges across multiple domains.
• Excellent communication and teamwork skills, with the ability to collaborate effectively in a dynamic environment.