RFSOI Technology Development Integration Staff Engineer

United Microelectronics Corporation (UMC); Singapore; On-site; SGD 140,000 - 190,000; Full time

Job summary

United Microelectronics Corporation (UMC) in Singapore seeks a Staff Technology Development Integration Engineer to lead RF-SOI technology development and integration across FEOL, MOL, and BEOL. You will drive process integration and collaborate with device, process, and design teams to meet stringent RF performance targets.

The ideal candidate holds a PhD or MSc in Electrical Engineering or related field, with 8+ years in semiconductor process integration and proven leadership in

Qualifications

• PhD or MSc in Electrical Engineering, Materials Science, Physics or related field.
• 8+ years of semiconductor process integration experience with RF technologies.
• Familiarity with RF-SOI device physics and integration challenges.
• Experience with CMOS or SOI processes and module interactions.
• Strong analytical and DOE skills; able to analyze yield data.

Responsibilities

• Lead end-to-end process integration for RF-SOI technology development from concept to transfer.
• Define and optimize integration schemes for FEOL, MOL, BEOL modules.
• Collaborate with device, process, and design teams to meet RF targets (linearity, loss, isolation).
• Drive yield improvement and defect reduction via failure analysis and data-driven methods.
• Develop and execute DOE to understand process interactions and device characteristics.
• Own integration-related problem solving including variability and reliability issues.
• Support silicon debugging, electrical characterization, and parametric correlations.
• Lead cross-functional integration reviews and provide technical direction to junior engineers.
• Interface with foundry/manufacturing partners for technology transfer and ramp-up.
• Document and present findings to internal stakeholders and leadership.

Education

PhD or MSc in Electrical Engineering/Materials Science/Physics

8+ years semiconductor process integration experience

DOE and statistical analysis

Leadership and cross-functional collaboration

Problem-solving under ambiguity

Job description

We are seeking a highly experienced Staff Technology Development Integration Engineer to lead the development and integration of advanced RF-SOI (Radio Frequency Silicon-On-Insulator) semiconductor technologies. This role will drive process integration across modules, enabling high-performance RF devices for applications such as 5G/6G, IoT, and automotive connectivity.

Key Responsibilities

• Lead end-to-end process integration for RF-SOI technology development, from early concept through qualification and production transfer.
• Define and optimize integration schemes involving FEOL, MOL, and BEOL modules for RF device performance (e.g., switches, LNAs, tuners).
• Collaborate closely with device engineering, process module teams (lithography, etch, deposition, implant), and design teams to meet RF performance targets (linearity, insertion loss, isolation).
• Drive yield improvement and defect reduction through systematic failure analysis and data-driven methodologies.
• Develop and execute DOE (Design of Experiments) to understand process interactions and optimize device characteristics.
• Own integration-related technical problem solving, including variability, reliability, and parametric issues.
• Support silicon debug, electrical characterization, and correlation between process parameters and RF performance.
• Lead cross-functional integration reviews and provide technical direction to junior engineers.
• Interface with foundry/manufacturing partners for technology transfer and ramp-up.
• Document and present technical findings to internal stakeholders and leadership.

Required Qualifications

• PhD or Master's degree in Electrical Engineering, Materials Science, Physics, or related field.
• 8+ years of semiconductor process integration experience, with strong exposure to RF technologies.
• Deep understanding of RF-SOI device physics and integration challenges is preferred.
• Experience with CMOS or SOI process technologies, including integration flows and module interactions.
• Strong analytical skills with hands-on experience in DOE, statistical analysis, and yield learning.
• Proven track record of solving complex integration problems in advanced nodes.
• Familiarity with RF device characterization and key metrics (harmonics, linearity, R_on, C_off, etc.).
• Excellent communication and leadership skills.
• Technical leadership and ownership
• Cross-functional collaboration
• Problem-solving under ambiguity
• Innovation in semiconductor technology development

Impact of the Role

This role is critical in enabling next-generation RF technologies that power modern wireless communication systems. You will directly influence device performance, manufacturability, and time-to-market for cutting-edge semiconductor solutions.