Senior RFSOI Tech Integration Engineer - RF Innovation

United Microelectronics Corporation (UMC)

Singapore

On-site

SGD 180,000 - 240,000

Full time

5 days ago
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Benefits offered by this job

Career resilience
Flexible growth paths
Meaningful impact

Job summary

United Microelectronics Corporation (UMC) invites a Senior Technology Development Integration Engineer to lead advancement of RFSOI platforms for next-generation communications. You will design and qualify new process modules and RF device structures to boost platform capability and performance, and coordinate DSM workflows for customer-specific applications.

Based in Singapore, you’ll collaborate with customers and cross-functional teams, ensuring robust integration, yield, and technical

Qualifications

  • Bachelor’s, Master’s or PhD in Electrical Engineering, Electronics, or Physics.
  • Experience in semiconductor process integration, ideally RF device or RFSOI development.
  • Strong device characterization and process qualification experience.
  • Excellent communication across teams and with customers.
  • Detail-oriented with a learning mindset and continuous improvement.

Responsibilities

  • Lead the development of RF/ RFSOI platforms and next‑gen technology for communication solutions.
  • Design and qualify new process modules and RF device structures to enhance capability.
  • Establish and validate new DSM flows for customer-specific applications.
  • Collaborate closely with customers on product verification and process alignment.
  • Coordinate cross‑functional activities from design to qualification to ensure robust integration.

Skills

Device characterization
Process qualification
Integration debugging
RF/RFSOI knowledge
Cross-functional collaboration

Education

Electrical/Electronics/Physics degrees

Tools

Semiconductor tooling

Job description

United Microelectronics Corporation (UMC) invites a Senior Technology Development Integration Engineer to lead advancement of RFSOI platforms for next-generation communications. You will design and qualify new process modules and RF device structures to boost platform capability and performance, and coordinate DSM workflows for customer-specific applications.

Based in Singapore, you’ll collaborate with customers and cross-functional teams, ensuring robust integration, yield, and technical

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