Principal Engineer, Radio Frequency

POET Technologies; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

POET Technologies is seeking an accomplished RF/microwave engineering leader to define and execute the RF strategy across photonic and semiconductor product lines. You will set the technical direction for antenna, matching network, and high-frequency interconnect architectures, and mentor a growing team.

You will lead RF measurement and validation, guide EM simulations with HFSS/SIwave/Q3D/ADS, and collaborate with cross-functional partners to align roadmaps with business priorities while

Qualifications

• 10+ years of RF/microwave design experience with proven technical leadership.
• Deep expertise in EM simulation tools such as HFSS, SIwave, Q3D, and ADS.
• Hands-on experience with RF measurement equipment including VNAs and antenna far-field systems.
• Strong understanding of impedance matching, S-parameters, antenna theory, and EMI/EMC.
• Strong cross-functional collaboration and communication skills at senior levels.

Responsibilities

• Define and lead RF design strategy across product lines (photonic and semiconductor).
• Mentor RF engineers and preserve RF performance across the full signal chain.
• Resolve critical RF issues including impedance mismatch, insertion loss, and EMI/EMC.
• Represent RF capabilities with partners, vendors, and customers.
• Track high-frequency protocols and translate standards into design roadmaps.

Skills

RF/microwave design

RF measurement

Technical leadership

Cross-functional collaboration

English communication

Education

Bachelor's/Master's/PhD in Electrical Engineering or related

Tools

Ansys HFSS

SIwave

Q3D

ADS

VNA

Job description

• Define and lead the RF/microwave design strategy across our photonic and semiconductor product lines, setting technical direction for antenna, matching network, and high-frequency interconnect architecture.
• Serve as the top technical authority on RF/EM simulation, providing expert guidance on Ansys HFSS, SIwave, Q3D, and ADS to resolve the most complex signal and power integrity challenges.
• Lead RF measurement and validation strategy, including S-parameter testing, antenna far-field characterization, and anechoic chamber measurement programs, and establish best practices across teams.
• Provide technical leadership and mentorship to SI/PI, hardware, and packaging engineers, ensuring RF performance is preserved across the full signal chain, from chip package through PCB.
• Own resolution of critical, escalated RF issues including impedance mismatch, insertion loss, return loss, and EMI/EMC compliance, acting as the final technical escalation point.
• Drive RF design strategy for new product introduction (NPI), partnering with cross-functional leadership to align technical roadmaps with business priorities.
• Author and review technical documentation, design standards, and specifications for RF subsystems across the organization.
• Represent RF engineering capability with external partners, PCB fabrication/assembly vendors, and key customers.
• Track emerging high-frequency protocols and industry standards (100G/200G/400G/800G) and translate them into forward-looking design roadmaps.
• Mentor and develop junior and mid-level RF engineers, building organizational depth in RF competency.

Requirements

• Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, RF/Microwave Engineering, or a related field.
• Minimum 10+ years of RF/microwave design experience, with a demonstrated track record of technical leadership.
• Deep expertise in EM simulation tools such as Ansys HFSS, SIwave, Q3D, and ADS, with demonstrated ability to resolve highly complex RF challenges.
• Extensive hands‑on experience with RF measurement equipment, including Vector Network Analyzers (VNA) and antenna far-field measurement systems.
• Deep understanding of RF fundamentals, including impedance matching, S-parameters, antenna theory, and EMI/EMC principles.
• Demonstrated experience leading or mentoring engineering teams.
• Strong track record of cross‑functional collaboration at a senior level.
• Excellent written and verbal communication skills in English, with the ability to communicate technical strategy to senior leadership.

Preferred Qualifications

• Experience in optical communications or semiconductor packaging environments at a senior or principal level.
• Deep familiarity with high-speed protocols such as PCIe, DDR, or high-speed SerDes.
• Experience with chip-package-board co-design and simulation at scale.
• Track record of leading mass production ramp and yield improvement initiatives.
• Patents or publications in RF/microwave design.

Location

This role can be based in Singapore, China, or Taiwan.