Research Fellow: 3D IC Cu-Cu Hybrid Bonding Expert

Nanyang Technological University Singapore; Singapore; Presencial; SGD 60 000 - 90 000; Tempo integral

Resumo da oferta

NTU Singapore, School of Electrical and Electronic Engineering, seeks a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for fine-pitch, high-density interconnects. You will develop and validate a new flow, enabling manufacturable 3D integration and collaborating across partners.

The candidate will integrate materials selection, wafer-level process development, and reliability demonstration to support NTU’s leadership in industry-relevant advanced packaging research.

Qualificações

• PhD in Materials, Microelectronics, EEE or related field.
• Hands-on semiconductor process development in cleanroom.
• Characterization: optical/profilometry, SEM/TEM, XPS/AFM; DoE/statistics a plus.
• Strong documentation, safety discipline, and clear communication in English.
• Process integration & optimization; root-cause/failure analysis.
• Reliability mindset with thermal & electrical stress tests.
• Collaboration with tool vendors/industry partners; concise reporting.

Responsabilidades

• Develop and run a Cu–Cu hybrid bonding flow for fine-pitch 3D integration.
• Optimize process windows to minimize contact resistance and voids; maintain cleanroom practices.
• Characterize materials and interfaces; translate data into process improvements.
• Validate reliability and scalability via thermal cycling and electrical stress tests.
• Report findings with clear technical reports/presentations; coordinate with partners.

Conhecimentos

PhD in Materials/Microelectronics

Cleanroom process development

Semiconductor characterization

DOE/Statistics

English communication

Process integration

Reliability testing

Collaboration with partners

Formação académica

PhD in Materials/Microelectronics/EEE

Ferramentas

SEM/TEM

XPS/AFM

Descrição da oferta de emprego

School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic standards and research. With over 3,000 undergraduates students and 2,000 graduate students it is one of the largest EEE schools in the world and ranks 4th in the field of Electrical & Electronic Engineering in the 2025 QS World University Rankings by Subjects.

Today, the School has become one of the world’s largest engineering schools that nurtures competent engineers and researchers. Each year, the School graduates over a thousand students who are ready to take on great ambitions and challenges.

For more details, please view: https://www.ntu.edu.sg/eee

We seek a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for fine-pitch, high-density interconnects by developing and validating a new flow with reliable dielectric sealing under ≤200 °C. The role integrates materials selection, wafer-level process development, and reliability demonstration to deliver a manufacturable 3D-integration solution that supports NTU’s leadership in industry-relevant advanced packaging research.

Key Responsibilities

• Develop and run a Cu–Cu hybrid bonding flow for fine-pitch 3D integration.
• Optimize process windows (pressure/temperature/anneal/surface activation) to minimize contact resistance and voids; maintain cleanroom/tool best practices.
• Characterize materials and interfaces using optical/profilometry, SEM/TEM, surface chemistry, and electrical IV; translate data into process improvements.
• Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles; build prototype stacks (e.g., interposer/test-chip) to evidence manufacturability.
• Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation, version control, and safety compliance.
  
  

Job Requirements

• PhD in Materials/ Microelectronics/ EEE/ or related.
• Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding; litho/etch/CMP/plasma/anneal).
• Characterization: optical/profilometry, SEM/TEM, XPS/AFM, electrical probing; DoE/statistics (Python/Matlab a plus).
• Strong documentation, safety discipline, and clear communication in English.
• Process integration & optimization; root-cause/failure analysis.
• Reliability mindset (design/interpret thermal & electrical stress tests).
• Collaboration with tool vendors/industry partners; concise reporting; ownership.
  
  

We regret to inform you that only shortlisted candidates will be notified.


Hiring Institution: NTU