Associate Engineer – Wire Bond Equipment

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; Presencial; SGD 28.000 - 45.000; Jornada completa

Descripción de la vacante

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a motivated Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

You will perform machine setup, qualification, and conversion for wire bond equipment, troubleshoot issues to minimize downtime, and conduct preventive and corrective maintenance. The role requires 12-hour rotating shifts, including day and night coverage, reflecting demanding production

Formación

• Diploma in Electrical, Electronics, Mechanical or Mechatronics is required.
• 2+ years hands-on experience with wire bond equipment maintenance and troubleshooting.
• Experience with KNS Maxum, iConn, or Rapid Bonder is preferred.
• Candidate should be able to support 12-hour rotating shifts.

Responsabilidades

• Perform machine setup, qualification, and conversion for wire bond equipment.
• Troubleshoot and repair equipment-related issues to minimize production downtime.
• Conduct preventive and corrective maintenance activities.
• Monitor equipment performance and implement improvement actions.
• Support production during machine breakdowns and urgent technical issues.
• Perform root cause analysis and corrective actions.
• Maintain equipment documentation and spare parts records.

Conocimientos

Troubleshooting

Problem solving

Shift flexibility

Educación

Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics

Herramientas

KNS Maxum

iConn

Rapid Bonder

Descripción del empleo

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

Key responsibilities

• Perform machine setup, qualification, and conversion for wire bond equipment.

• Troubleshoot and repair equipment-related issues to minimize production downtime.

• Conduct preventive and corrective maintenance activities.

• Monitor equipment performance and implement improvement actions.

• Support production during machine breakdowns and urgent technical issues.

• Perform root cause analysis and corrective actions.

• Maintain equipment documentation and spare parts records.

What we're looking for

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.

• Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.

• Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.

• Strong troubleshooting and problem-solving skills.

• Knowledge of semiconductor backend assembly processes is an advantage.

• Able to support 12-hour rotating shifts.

• Willing to work both Day Shift and Night Shift based on operational requirements.