Test & Packaging Engineering Leader (Semiconductor)

RECRUIT123 PTE. LTD.; Singapore; On-site; SGD 180,000 - 320,000; Full time

Job summary

RECRUIT123 PTE. LTD. is seeking an experienced Test & Packaging Engineering Leader to drive the full lifecycle for advanced semiconductor products, from NPI through HVM transfer.

You will lead a team of engineers, shape test requirements with cross-functional partners, and manage vendor relationships to ensure production readiness. The role requires strong leadership, over a decade of test/packaging experience in semiconductors, and a proven track record in NPI and cost-of-test improvements.

Qualifications

• 10+ years in test/packaging in semiconductor industry
• 5+ years in a managerial/leadership role
• Proven track record in NPI, test solution development, and HVM transfer
• Strong understanding of advanced packaging and test processes (wafer-level/final test, wire bonding)
• Experience managing tester RFQ processes and vendor negotiations
• Strong project management, cross-functional collaboration, and stakeholder management
• Excellent leadership and people management capabilities

Responsibilities

• Lead the NPI effort to develop in-house test solutions and manage tester RFQ process
• Own transfer of qualified test solutions into High Volume Manufacturing with production readiness
• Define test requirements and specifications with design, process, and packaging teams
• Evaluate, select, and manage test equipment vendors and suppliers
• Drive test yield improvement and cost-of-test reduction initiatives
• Establish test methodologies, standards, and documentation for scale-up and transfer
• Manage timelines, budgets, and resources for test development programs
• Lead and develop a team of test and packaging engineers
• Collaborate with R&D, operations, quality, and supply chain on milestones
• Provide technical guidance on packaging/test integration for advanced semiconductor devices

Skills

Leadership

Test & Packaging Eng

NPI

Cross-functional

Vendor management

Project management

Education

Electrical Eng (BSc/MSc)

Materials Science

Job description

Test & Packaging Engineering Leader (Semiconductor)

Location: Singapore

Job Description

Our client, a semiconductor manufacturing company, is seeking an experienced leader to lead test and packaging engineering for advanced semiconductor products. This role owns the full test development lifecycle from New Product Introduction through to High Volume Manufacturing transfer and leads a team of engineers supporting production scale-up.

Key Responsibilities

• Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process
• Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness
• Partner with design, process, and packaging engineering teams to define test requirements and specifications for advanced semiconductor products
• Evaluate, select, and manage relationships with test equipment vendors and suppliers
• Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle
• Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer
• Manage project timelines, budgets, and resources for test development programs
• Lead and develop a team of test and packaging engineers
• Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones
• Provide technical guidance on packaging and test integration challenges for advanced semiconductor devices

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in test/packaging engineering within the semiconductor industry, with at least 5 years in a managerial or leadership capacity
• Proven track record in NPI, test solution development, and HVM transfer
• Strong understanding of advanced packaging and test processes (e.g., wafer-level/final test, wire bonding, or die attach)
• Experience managing tester RFQ processes and vendor negotiations
• Strong project management, cross-functional collaboration, and stakeholder management skills
• Excellent leadership and people management capabilities