Principal Process Engineer: Advanced Packaging & Thin Films

ASM; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

ASM is seeking a Principal/Senior Process Engineer to advance semiconductor process technologies with emphasis on thin-film deposition and advanced packaging. You will develop solutions for next-generation devices and influence performance in logic, memory, and power applications.

You will mentor engineers, lead DOE/RSM studies, and collaborate with customers to define requirements, while traveling up to 10% for remote-site support and demonstrations.

Qualifications

• Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics required.
• Direct experience with D2W/W2W Hybrid bonding and surface preparation steps.
• 10+ years of combined education, research, and work in thin-film deposition and advanced packaging processes.

Responsibilities

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM; interpret and analyze data.
• Develop new films or processes for emerging packaging applications and perform advanced materials characterization.
• Mentor Process Engineers and lead technical problem-solving sessions using Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

Skills

Thin-film deposition

D2W/W2W Hybrid bonding

Materials characterization

DOE & RSM analytics

Project leadership

Education

Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics

Tools

XPS

SIMS

RBS

AFM

XRR

XRD

TEM

SEM

Ellipsometry

Job description

ASM is seeking a Principal/Senior Process Engineer to advance semiconductor process technologies with emphasis on thin-film deposition and advanced packaging. You will develop solutions for next-generation devices and influence performance in logic, memory, and power applications.

You will mentor engineers, lead DOE/RSM studies, and collaborate with customers to define requirements, while traveling up to 10% for remote-site support and demonstrations.