Senior Mechanical Engineer – Advanced Packaging Systems

ASM; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

ASM in Singapore is hiring engineers across experience levels for the Advanced Packaging team. You will work at the intersection of cutting‑edge technology, engineering, field operations, and customer environments to ensure devices perform reliably from concept to high‑volume manufacturing.

Join a global, diverse workforce and contribute to next‑generation semiconductor equipment, with hands‑on challenges, mentorship and clear growth paths. Willingness to travel internationally is expected.

Qualifications

• Bachelor’s, Master’s or PhD in Engineering.
• Experience in semiconductor equipment.
• Knowledge of CE, NFPA, Semi S2-95 and related standards.
• Strong system-level problem solving mindset.

Responsibilities

• Design and develop next-generation semiconductor equipment within ASM’s Advanced Packaging team.
• Collaborate with cross-functional teams across manufacturing, operations, and quality.
• Provide technical support and troubleshooting for equipment and automation systems.
• Own BOM release and maintenance with accurate documentation.
• Lead or support NPIs including lab validation and ramp to high-volume manufacturing.
• Translate field feedback into design improvements and reliability enhancements.

Skills

Engineering experience

Semiconductor equipment

System-level problem solving

Willingness to travel

Education

Bachelor’s, Master’s or PhD in Engineering

Job description

ASM in Singapore is hiring engineers across experience levels for the Advanced Packaging team. You will work at the intersection of cutting‑edge technology, engineering, field operations, and customer environments to ensure devices perform reliably from concept to high‑volume manufacturing.

Join a global, diverse workforce and contribute to next‑generation semiconductor equipment, with hands‑on challenges, mentorship and clear growth paths. Willingness to travel internationally is expected.