Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 150,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Principal Engineer to provide technical leadership for NAND Advanced Thin Films. The role involves defining technical strategy, mentoring engineering teams, and driving innovations in film processes.

Ideal candidates should hold a PhD with relevant experience in Electrical Engineering or similar fields, and possess mastery of deposition techniques such as ALD/CVD. This mission-critical role is key to advancing production scalability and manufacturability.

Qualifications

• PhD with 5+ years or Master's with 7+ years or Bachelor's with 10+ years of relevant experience.
• Experience in Thin Films R&D/PD for NAND including CVD and diffusion thin films.
• Ability to drive novel chemistries/materials/hardware solutions.

Responsibilities

• Define and implement technical strategy for film process development.
• Lead multi‑functional teams for scaling thin film processes.
• Oversee development of process modules with focus on manufacturability.

Skills

Thin film deposition (ALD/CVD)

Advanced characterization techniques (XRR, SEM, TEM)

SPC/DOE/data analytics

Technical leadership

Education

PhD in Electrical Engineering or related field

Master’s degree in a relevant field

Bachelor’s degree in a relevant field

Job description

Job / Role Summary

The Principal Engineer provides technical leadership for NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing.

Main Responsibilities

• Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives.
• Lead multi‑functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.
• Oversee end‑to‑end development of process modules with focus on manufacturability, scalability, and integration readiness.
• Resolve complex technical challenges with significant business implications (root cause analysis, mitigation of process/device failures).
• Drive technology transfer and ramp‑up activities to enable transition from R&D to high‑volume manufacturing.
• Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/material utilization.

Other Responsibilities

• Mentor senior engineers and influence technical direction across the organization.
• Represent the function in technical forums and strategic collaborations; benchmark against industry standards.
• Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives.
• Integrate AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Master’s ≥7 years of relevant experience.
• Bachelor’s ≥10 years of relevant experience.
• Demonstrated experience in Thin Films R&D/PD for NAND including CVD and diffusion thin films.

Must‑Have Technical Skills

• Mastery of thin film deposition (ALD/CVD) for high‑density NAND applications; process design/optimization/integration.
• Advanced characterization capability (XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown).
• Proficiency in SPC/DOE/data analytics for optimization and fixing.
• Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).

Must‑Have Soft Skills

• Technical leadership through influence; strong cross‑functional and cross‑site collaboration.
• Mentorship and clear executive‑ready technical communication.

Highly Desirable / Preferred

• Competitive benchmarking / industry trend assessment translating into actionable roadmaps.
• Embody Micron’s core values: People – Respect, develop and empower others; Innovation – Drive continuous improvement and breakthrough thinking; Tenacity – Show grit and determination; Collaboration – Build trust and foster teamwork; Customer Focus – Deliver excellence and value.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran, or disability status.