Principal Engineer – Process Development, Cell Film, NAND

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 80,000 - 120,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a Principal Engineer to lead technical development for Cell Film processes aimed at next-generation NAND devices. You will define the technical strategy, lead integration efforts, and resolve complex challenges to prepare for high-volume manufacturing.

The ideal candidate will possess significant experience in R&D environments, along with a PhD or relevant degree. This position offers the chance to make a substantial impact on technological advancements in the semiconductor industry.

Qualifications

• 5+ years experience with a PhD, 7+ years with a Master's or 10+ years with a Bachelor's in Engineering or related field.
• Proven experience in thin-film R&D for microelectronic devices.
• Expertise in diagnosing performance and yield issues in manufacturing.

Responsibilities

• Define technical strategy for cell film process development.
• Lead cross-functional teams for technology integration.
• Drive technology transfer to high-volume manufacturing.

Skills

ALD/CVD thin-film processes expertise

Process optimization

Data analytics

Education

PhD or Master's or Bachelor's in relevant fields

Job description

Role Summary

The Principal Engineer provides technical leadership for Cell Film process development, defining technical direction, fostering innovation, and ensuring successful integration of new processes into manufacturing to enable next‑generation NAND device scaling. The role defines and implements technical strategy, leads cross‑functional teams, owns end‑to‑end module development with manufacturability and scalability readiness, resolves complex technical challenges with business impact, and drives transfer and ramp readiness into high‑volume manufacturing.

Main Responsibilities

• Define and implement technical strategy for cell film process development aligned to business and technology objectives; identify emerging trends, risks and opportunities, and recommend future investments.
• Lead multi‑functional development, integration and scaling of thin film processes tailored for advanced NAND devices; ensure manufacturability, scalability and readiness for integration.
• Drive technology transfer and ramp‑up activities to ensure seamless transition from R&D to high‑volume manufacturing.
• Resolve complex technical challenges, including root‑cause analysis and mitigation of process and device failures; lead cost‑reduction, yield‑improvement and reliability‑enhancement programs through innovative process and material utilization.

Minimum Qualifications

• PhD with ≥5 years experience, or Master’s with ≥7 years, or Bachelor’s with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Experience in thin‑film R&D for microelectronic devices and a proven track record of leading complex technology development.

Must‑Have Technical Skills

• Deep hands‑on expertise in ALD/CVD thin‑film processes for 3D NAND cell applications, including process development, optimization and sustainment in manufacturing.
• Strong understanding of process‑device interactions, scaling challenges and reliability behavior, with the ability to diagnose film‑related performance and yield issues.
• Proficient in DOE, SPC and data analytics to optimize processes and resolve complex issues, while serving as a technical lead and mentor across process, integration and manufacturing teams.

Must‑Have Soft Skills

• Structured problem‑solving and learning agility in an R&D environment.
• Clear communication and cross‑functional collaboration.

Highly Preferred

• Contributions to technology benchmarking, roadmap inputs and clear technical documentation or IP generation.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity or national origin. To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail].