Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND

Micron Technology; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology Singapore seeks a Staff Engineer to lead ownership of NAND Advanced Thin Films process development. You will drive dielectric and carbon film processes, translating experimental results into scalable improvements while collaborating with cross-functional teams to ensure robust integration and performance.

The role requires hands-on deposition/characterization skills, strong execution discipline, and the ability to mentor junior engineers and share knowledge.

Qualifications

• PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated thin film R&D/PD experience and ability to link process conditions to material properties/device behavior.

Responsibilities

• Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
• Execute well-designed experiments, analyze data, and translate results into process improvements.
• Support scaling of dielectric and carbon film processes across nodes and platforms.
• Own defined portions of a process module or sub-module; track margins, sensitivities, and integration risks.
• Drive issue resolution for process and tool-related problems within assigned scope.
• Work with integration and device teams to ensure compatibility and performance.
• Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root-cause investigations.
• Build hands-on knowledge of dielectric/carbon film equipment; support tool qualifications, upgrades, and transfers.

Skills

Thin film deposition fundamentals

Materials science knowledge

Process physics understanding

Cross-functional collaboration

Education

PhD in Electrical Engineering / Materials Science

Master’s in Electrical Engineering / Chemical Engineering

Bachelor’s in related field

Job description

Our vision is to transform how the world uses information to enrich life for all.

Role Summary

The Staff Engineer delivers module/sub‑module ownership in NAND Advanced Thin Films process development, owning defined portions of the process space (dielectric/carbon film processes via CVD/Diffusion) and driving robustness, capability, and integration readiness. Success requires strong hands‑on deposition/characterization skills, cross‑functional execution discipline, and the ability to translate experimental results into scalable process improvements.

Main Responsibilities

Process Development & Optimization

• Develop, optimize, and characterize thin film processes (CVD/Diffusion) to meet performance, reliability, and manufacturability targets.
• Execute well‑designed experiments, analyze data, and translate results into process improvements.
• Support scaling of dielectric and carbon film processes across nodes and platforms.

Module Ownership (Growing Scope)

• Own defined portions of a process module or sub‑module under guidance from senior engineers; track margins, sensitivities, and integration risks.
• Drive issue resolution for process and tool‑related problems within assigned scope.

Process Integration & Correlation

• Work closely with integration and device teams to ensure compatibility and structural/electrical performance.
• Correlate material, structural, and electrical data to guide process optimization; support failure analysis and root‑cause investigations.

Tool & Hardware Engagement

• Build strong hands‑on knowledge of dielectric/carbon film equipment behavior; support tool qualifications, upgrades, and transfers; partner with suppliers to improve stability/capability.

Other Responsibilities

• Communicate results clearly through reports, reviews, and data summaries; escalate risks with data‑driven recommendations.
• Mentor junior engineers and contribute to team knowledge sharing.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one’s scope of work.

Candidate Profile

Minimum Qualifications / Experience

• PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Demonstrated thin film R&D/PD experience and ability to link process conditions to material properties/device behavior.

Must-Have Technical Skills

• Thin film deposition fundamentals (CVD/Diffusion) and materials/chemistry/process physics.
• Familiarity with fab metrology and film characterization methods (structural/mechanical/optical/electrical as applicable).
• Working knowledge of plasma processes, vacuum systems, and chemical reactions.

Must-Have Soft Skills

• Strong execution ownership and structured troubleshooting.
• Cross‑functional collaboration and concise technical communication.

Highly Desirable / Preferred

• Understanding NAND thin film structure and electrical needs.

Embody Micron’s Core Values

• People – Respect, develop and empower others
• Innovation – Drive continuous improvement and breakthrough thinking
• Tenacity – Show grit and determination
• Collaboration – Build trust and foster teamwork
• Customer Focus – Deliver excellence and value

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail].