Principal Engineer, Dry Etch & NAND Process Innovation

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Principal Engineer / MTS for Dry Etch to architect and deploy next-generation plasma etch solutions enabling NAND scaling and new device architectures.

You will lead efforts in process development, integration, and collaboration across R&D and manufacturing teams. You will leverage AI-enabled engineering tools and digital workflows to accelerate development and decision-making, guiding senior engineers and suppliers to achieve aggressive

Qualifications

• Extensive experience in ICP/CCP plasma etch for advanced semiconductor process development.
• Solid foundation in plasma physics, transport phenomena, and materials interactions.
• Demonstrated experience in developing and qualifying advanced dry etch processes.

Responsibilities

• Develop and refine dry etch processes to satisfy NAND roadmap criteria for structure, performance, and yield.
• Guide the development of next-generation etch solutions, including high aspect ratio patterning and CD management.
• Collaborate with Process Integration and other teams to drive technology development and manufacturability.

Skills

Plasma etch

Process integration

AI/ML in eng

Leadership

Semiconductor physics

Education

PhD/MS in EE

Tools

Etch equipment

Job description

Micron Technology, Inc. in Singapore is seeking a Principal Engineer / MTS for Dry Etch to architect and deploy next-generation plasma etch solutions enabling NAND scaling and new device architectures.

You will lead efforts in process development, integration, and collaboration across R&D and manufacturing teams. You will leverage AI-enabled engineering tools and digital workflows to accelerate development and decision-making, guiding senior engineers and suppliers to achieve aggressive