Porous SiC DIW Research Intern

InternSG; Singapore; On-site; SGD 10,000 - 15,000; Full time

Job summary

InternSG in Singapore seeks an ambitious undergraduate for an internship focused on developing porous silicon carbide components using Direct Ink Writing (DIW). You will formulate DIW inks, perform rheology tests, and run printing experiments under mentorship.

Alongside processing, you will assist with drying, debinding and sintering, quantify porosity and mechanical properties, and document findings for technical reports and presentations.

Qualifications

• Formulation of DIW inks for SiC
• Rheological characterization and printability assessment
• Hands-on 3D printing with DIW systems
• Microscopy and materials characterization basics

Responsibilities

• Prepare and test SiC-based DIW inks.
• Conduct rheological measurements and assess printability.
• Run 3D printing experiments and optimize printing parameters.
• Support drying, debinding, and sintering of printed parts.
• Document results and contribute to technical reports.

Skills

DIW inks

Rheology tests

3D printing

Material characterization

Education

Undergraduate in Materials Science/Mechanical/Chemical Engineering

Strong academic performance

Tools

DIW equipment

Job description

InternSG in Singapore seeks an ambitious undergraduate for an internship focused on developing porous silicon carbide components using Direct Ink Writing (DIW). You will formulate DIW inks, perform rheology tests, and run printing experiments under mentorship.

Alongside processing, you will assist with drying, debinding and sintering, quantify porosity and mechanical properties, and document findings for technical reports and presentations.