Assistant Engineer

InternSG

Singapore

On-site

SGD 10,000 - 15,000

Full time

14 days+
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Job summary

InternSG in Singapore seeks an ambitious undergraduate for an internship focused on developing porous silicon carbide components using Direct Ink Writing (DIW). You will formulate DIW inks, perform rheology tests, and run printing experiments under mentorship.

Alongside processing, you will assist with drying, debinding and sintering, quantify porosity and mechanical properties, and document findings for technical reports and presentations.

Qualifications

  • Formulation of DIW inks for SiC
  • Rheological characterization and printability assessment
  • Hands-on 3D printing with DIW systems
  • Microscopy and materials characterization basics

Responsibilities

  • Prepare and test SiC-based DIW inks.
  • Conduct rheological measurements and assess printability.
  • Run 3D printing experiments and optimize printing parameters.
  • Support drying, debinding, and sintering of printed parts.
  • Document results and contribute to technical reports.

Skills

DIW inks
Rheology tests
3D printing
Material characterization

Education

Undergraduate in Materials Science/Mechanical/Chemical Engineering
Strong academic performance

Tools

DIW equipment

Job description

Project Title

Development of Porous Silicon Carbide (SiC) Structures by Direct Ink Writing (DIW)

Project Overview

We are seeking a motivated intern to join an exciting research and development project focused on the fabrication of porous silicon carbide (SiC) components using Direct Ink Writing (DIW), an emerging additive manufacturing technology. The project aims to develop novel SiC formulations and printing processes that enable tunable porosity and tailored properties for thermal management, filtration, energy, and other advanced engineering applications.

This internship offers a unique opportunity to work on cutting-edge additive manufacturing technology within a research environment, with the potential for successful developments to be translated into industrial applications through collaboration with industry partners.

Key Responsibilities

Assist in the formulation and preparation of SiC-based DIW inks. Perform rheological characterization and evaluate printability of materials. Conduct 3D printing experiments using DIW equipment. Support drying, debinding, and sintering processes of printed components. Characterize porosity, density, microstructure, and mechanical properties. Analyze experimental data and assist in process optimization. Document research findings and contribute to technical reports and presentations.

Learning Opportunities

Hands-on experience in additive manufacturing and advanced ceramics. Exposure to materials formulation, rheology, and sintering technologies. Practical experience with microscopy and materials characterization techniques. Understanding of industrial R&D workflows and technology development. Opportunities to interact with researchers working on advanced manufacturing technologies.

Preferred Qualifications

Undergraduate or postgraduate student in Materials Science, Mechanical Engineering, Chemical Engineering, Manufacturing Engineering, or related disciplines. Interest in additive manufacturing, advanced materials, and R&D.

Basic laboratory experience is advantageous but not required. Strong analytical and problem-solving skills.

Why Join This Project?

Work on a high-impact research project with potential industrial applications. Gain exposure to state-of-the‑art additive manufacturing technologies. Receive direct mentorship from a Principal Research Engineer with over 30 years of experience in advanced manufacturing research and successful supervision of numerous IA, undergraduate, and postgraduate students, and Contribute to the development of next‑generation ceramic manufacturing solutions. This internship is ideal for students interested in pursuing careers in advanced manufacturing, materials engineering, or research and development.

Preferred Qualifications

JC, Polytechnic, Undergraduate, or Postgraduate students from Materials Science, Mechanical Engineering, Chemical Engineering, Manufacturing Engineering, or related disciplines are welcome to apply.

Strong academic performance is required; candidates with a good GPA will be preferred.

Passion for research, innovation, and advanced manufacturing technologies.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Porous SiC DIW Research Intern
Porous SiC DIW Research Intern

InternSG • Singapore

On-site
SGD 10,000 - 15,000
Scientist, Metal & Ceramic Forming
Scientist, Metal & Ceramic Forming

A*STAR - Agency for Science, Technology and Research • Singapore

On-site
SGD 120,000 - 180,000
Intern - Process & Equipment Engineer (Diffusion)
Intern - Process & Equipment Engineer (Diffusion)

1100 Micron SemiAsiaOP Pte Ltd • Singapore

On-site
SGD 20,000 - 31,000
Intern - Process & Equipment Engineer (Diffusion)
Intern - Process & Equipment Engineer (Diffusion)

Micron • Singapore

On-site
SGD 17,000 - 23,000
Intern - Chemical Mechanical Planarization Process Engineering
Intern - Chemical Mechanical Planarization Process Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD • Singapore

On-site
SGD 17,000 - 23,000
Process Engineer Internship: Enhancing CVD process efficiency and film quality through systematic recipe optimization
Process Engineer Internship: Enhancing CVD process efficiency and film quality through systematic recipe optimization

Applied Materials South East Asia • Singapore

On-site
SGD 11,000 - 20,000
Intern - Chemical Mechanical Planarization Process Engineering
Intern - Chemical Mechanical Planarization Process Engineering

1100 Micron SemiAsiaOP Pte Ltd • Singapore

On-site
SGD 20,000 - 27,000
Potential full-time opportunities
5-month internship (Jan–May 2027)
Intern - Chemical Mechanical Planarization Process Engineering
Intern - Chemical Mechanical Planarization Process Engineering

Micron • Singapore

On-site
SGD 17,000 - 23,000
Engineering Intern
Engineering Intern

Applied Materials South East Asia • Singapore

On-site
SGD 17,000 - 28,000
Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)
Technology Development Engineer – Hybrid Bonding & Advanced Packaging (Internship)

Applied Materials South East Asia • Singapore

On-site
SGD 11,000 - 17,000