Process & Equipment Engineer — HAR Gap-Fill for Stronger Die

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 20,000 - 31,000; Full time

Job summary

Micron Singapore is offering a full-time internship focused on Enhancing Poly-SiGe gap fill in high aspect ratio structures to strengthen dice and reduce wafer bending. The intern will study deposition conditions, analyze film growth, conformality and voids, and propose strategies for improved fill and robustness.

The role involves DOE, SEM/TEM cross-section analysis, and collaboration with cross-functional teams to map process windows and qualification plans for scalable manufacturing

Qualifications

• Strong analytical and problem-solving skills.
• Familiarity with machine learning, statistical analysis, and AI-enabled workflows.
• Familiarity with semiconductor materials, thin-film deposition, process integration, or materials characterization.
• Familiarity with Design of Experiments, statistical analysis, and interpretation of experimental data.

Responsibilities

• Investigate effects of process parameters on fill depth and gap-fill in HAR structure.
• Identify process conditions that improve bottom-up fill while maintaining open feature entrances.
• Identify critical fill characteristics that contribute to structural robustness.
• Recommend optimized window and qualification plan.

Skills

Strong analytical skills

Problem-solving

Machine learning familiarity

Statistical analysis

AI-enabled workflows familiarity

Semiconductor materials knowledge

Thin-film deposition knowledge

Process integration knowledge

Materials characterization

Design of Experiments

Data interpretation

Education

Engineering degree (current student)

Job description

Micron Singapore is offering a full-time internship focused on Enhancing Poly-SiGe gap fill in high aspect ratio structures to strengthen dice and reduce wafer bending. The intern will study deposition conditions, analyze film growth, conformality and voids, and propose strategies for improved fill and robustness.

The role involves DOE, SEM/TEM cross-section analysis, and collaboration with cross-functional teams to map process windows and qualification plans for scalable manufacturing