Diffusion Process Engineer: Poly-SiGe Gap-Fill

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 13,000 - 20,000; Full time

Job summary

Micron Technology, Inc. is offering a full-time internship in Singapore focused on Enhancing Poly-SiGe gap fill in HAR structures to improve die strength and reduce wafer bending.

You will study deposition conditions, film growth, and defect formation, and work with cross-functional engineers to propose robust process windows. The project spans from Jan to Jun 2027 and emphasizes hands-on materials science, SEM/TEM analysis, DOE planning, and collaboration across teams for scalable yield

Qualifications

• Strong analytical and problem-solving skills.
• Familiarity with machine learning, statistical analysis, and AI-enabled workflows.
• Familiarity with semiconductor materials, thin-film deposition, process integration, or materials characterization.
• Familiarity with Design of Experiments, statistical analysis, and interpretation of experimental data.

Responsibilities

• Investigate effects of process parameters on fill depth and gap-fill in HAR structures.
• Identify conditions that improve bottom-up fill while keeping entrances open.
• Identify key fill characteristics that contribute to die-strength and reliability.
• Propose optimized process window and qualification plan.

Skills

Analytical skills

Machine learning familiarity

Materials characterization

Design of Experiments

Education

Engineering degree in progress

Tools

SEM

TEM

Job description

Micron Technology, Inc. is offering a full-time internship in Singapore focused on Enhancing Poly-SiGe gap fill in HAR structures to improve die strength and reduce wafer bending.

You will study deposition conditions, film growth, and defect formation, and work with cross-functional engineers to propose robust process windows. The project spans from Jan to Jun 2027 and emphasizes hands-on materials science, SEM/TEM analysis, DOE planning, and collaboration across teams for scalable yield