Packaging Test Engineer - 2.5D/3D Yield & Test

GlobalFoundries; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

GlobalFoundries is seeking a motivated talent to join the Advanced Packaging Process Integration & Yield Enhancement team as a test engineer.

The successful candidate will support electrical test, product characterization, and yield-learning activities for 2.5D and 3D heterogeneous integration technologies, including chiplet-based packages, interposer and through-silicon-via (TSV) structures, die-to-wafer & wafer-to-wafer hybrid bonding and multi-die stacking.

Qualifications

• Bachelor's degree in a relevant technical field.
• Basic understanding of semiconductor devices, electrical measurements, circuits, and data interpretation.
• Working knowledge of laboratory instruments such as digital multimeters, oscilloscopes, source-measure units, power supplies, or parameter analyzers.
• Ability to analyze structured datasets using Excel or a technical analysis environment such as Python, JMP, or MATLAB.
• Strong problem-solving skills, attention to detail, and willingness to learn unfamiliar technologies and tools.
• Strong written and verbal communication skills and the ability to work effectively in a cross-functional team.

Responsibilities

• Support Test Development: Assist in developing, validating, and releasing electrical test methods for wafers, dies, interposers, package-level structures, and advanced packaging test vehicles.
• Execute Characterization: Conduct electrical characterization, engineering experiments, and data collection across process and product development lots under guidance from senior engineers.
• Test Hardware Support: Help define, qualify, and troubleshoot probe cards, sockets, load boards, interface hardware, cables, and related fixtures used for wafer-level and package-level testing.
• Data Analysis and Yield Learning: Analyze test results using statistical and visualization tools to identify trends, outliers, failure signatures, and yield-loss mechanisms. Summarize findings clearly for technical reviews.
• Failure Isolation: Support electrical fault isolation and coordinate with failure-analysis, integration, process, and reliability teams to determine potential root causes and verify corrective actions.
• Test Coverage and Correlation: Assist with test coverage reviews, guardband evaluation, repeatability and reproducibility studies, and correlation between bench, wafer-sort, final-test, and reliability data.
• Process and Product Qualification: Support development builds, qualification activities, reliability readouts, engineering change evaluations, and manufacturing readiness for new advanced packaging solutions.
• Continuous Improvement: Contribute to cycle-time reduction, test-time optimization, automation, data-quality improvement, and standardization of test methods and reports.
• Documentation: Maintain test plans, specifications, procedures, experiment records, data summaries, validation reports, and lessons learned in accordance with the team's document-control practices.
• Process Integration Support: Assist in developing and maintaining integrated process flows for advanced packaging structures from incoming wafer or die through assembly, test, and qualification.
• Module Coordination: Work with unit-process owners on lithography, deposition, plating, etch, CMP, wafer thinning, temporary bonding and debonding, dicing, die bonding, underfill, molding, and thermal processing, as applicable to the assigned technology.
• Cross-Functional Collaboration: Work effectively with local and global engineering teams, suppliers, and manufacturing partners; communicate progress, risks, and technical observations in a timely manner.
• Safety, Quality, and Compliance: Follow applicable environmental, health, safety, cleanroom, laboratory, quality, document-control, and information-security requirements.

Skills

Electrical measurements

Data interpretation

Problem solving

Cross-functional teamwork

Education

Bachelor's degree in Electrical Engineering

Tools

Python

MATLAB

JMP

Excel

Job description

GlobalFoundries is seeking a motivated talent to join the Advanced Packaging Process Integration & Yield Enhancement team as a test engineer.

The successful candidate will support electrical test, product characterization, and yield-learning activities for 2.5D and 3D heterogeneous integration technologies, including chiplet-based packages, interposer and through-silicon-via (TSV) structures, die-to-wafer & wafer-to-wafer hybrid bonding and multi-die stacking.