NAND Package & Silicon Integration Engineer

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 45,000 - 65,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking an Engineer Package–Silicon Integration to support NAND package and silicon integration for next-generation memory products. This entry-level position provides structured exposure to various engineering tasks under mentorship.

The ideal candidate will hold a Bachelor’s or Master’s degree in Engineering and have less than 2 years of relevant experience. Responsibilities include chip-package interaction assessments and assisting package design engineers.

Qualifications

• Less than 2 years of relevant experience, including internships.
• Fundamental understanding of semiconductor manufacturing.
• Strong written and verbal communication skills.

Responsibilities

• Support chip-package interaction assessments.
• Assist in investigating wafer dicing and integration topics.
• Participate in DFMEA / PFMEA activities.

Skills

Attention to detail

Collaboration

Microsoft Excel

Data analysis

Education

Bachelor’s or Master’s degree in Engineering

Tools

Microsoft Word

Microsoft PowerPoint

Job description

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking an Engineer Package–Silicon Integration to support NAND package and silicon integration for next-generation memory products. This entry-level position provides structured exposure to various engineering tasks under mentorship.

The ideal candidate will hold a Bachelor’s or Master’s degree in Engineering and have less than 2 years of relevant experience. Responsibilities include chip-package interaction assessments and assisting package design engineers.