Early-Career Package–Silicon Integration Engineer

Micron Technology; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

Micron Technology is seeking an Engineer for Package–Silicon Integration in Singapore. This early-career role supports NAND package integration for next-generation memory products, offering technical contribution alongside experienced engineers.

The ideal candidate will collaborate with various teams to learn and assist in semiconductor manufacturing processes. Responsibilities include data collection, analysis, documentation, and participation in risk assessment activities. A Bachelor’s or Master’s degree in Engineering with some experience in relevant fields is required.

Qualifications

• 2 years of relevant experience in semiconductor, materials, or manufacturing fields.
• Fundamental understanding of semiconductor manufacturing or packaging concepts.
• Strong attention to detail and willingness to learn.

Responsibilities

• Support chip-package interaction assessments and data analysis.
• Assist in investigating wafer dicing and integration topics.
• Participate in DFMEA / PFMEA activities.

Skills

Semiconductor manufacturing

Data analysis

Collaboration

Problem-solving methods

Education

Bachelor’s or Master’s degree in Engineering

Tools

Microsoft Excel

Microsoft Word

Microsoft PowerPoint

Job description

Micron Technology is seeking an Engineer for Package–Silicon Integration in Singapore. This early-career role supports NAND package integration for next-generation memory products, offering technical contribution alongside experienced engineers.

The ideal candidate will collaborate with various teams to learn and assist in semiconductor manufacturing processes. Responsibilities include data collection, analysis, documentation, and participation in risk assessment activities. A Bachelor’s or Master’s degree in Engineering with some experience in relevant fields is required.