ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

Micron Technology is seeking an Engineer for Package–Silicon Integration in Singapore. This early-career role supports NAND package integration for next-generation memory products, offering technical contribution alongside experienced engineers.

The ideal candidate will collaborate with various teams to learn and assist in semiconductor manufacturing processes. Responsibilities include data collection, analysis, documentation, and participation in risk assessment activities. A Bachelor’s or Master’s degree in Engineering with some experience in relevant fields is required.

Qualifications

• 2 years of relevant experience in semiconductor, materials, or manufacturing fields.
• Fundamental understanding of semiconductor manufacturing or packaging concepts.
• Strong attention to detail and willingness to learn.

Responsibilities

• Support chip-package interaction assessments and data analysis.
• Assist in investigating wafer dicing and integration topics.
• Participate in DFMEA / PFMEA activities.

Skills

Semiconductor manufacturing

Data analysis

Collaboration

Problem-solving methods

Education

Bachelor’s or Master’s degree in Engineering

Tools

Microsoft Excel

Microsoft Word

Microsoft PowerPoint

Job description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Engineer Package–Silicon Integration

As an Engineer, Package–Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products.

In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities. You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives.

This position is designed for early‑career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment.

Key Responsibilities

• Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
• Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
• Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
• Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
• Support execution of test vehicles and DOEs, including data collection, basic analysis, and report preparation.
• Learn Micron’s package and silicon development flows, design rules, and change‑management processes.
• Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing.
• Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems.

Required Qualifications

Education & Experience

• Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
• 2 years of relevant experience, including internships, co‑op programs, or research experience in semiconductor, materials, or manufacturing fields.

Technical & Professional Skills

• Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
• Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships.
• Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback.
• Strong attention to detail and willingness to learn new tools, processes, and technologies.
• Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation.
• Good written and verbal communication skills, with the ability to collaborate effectively in a team environment.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.