MTS, Process (Wet Etch)

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 110,000 - 150,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a Member of Technical Staff, Process (Wet) to develop and establish production processes for wet etch and plating. The role focuses on transferring from pilot to production, establishing specs and ensuring quality and safety documentation, with cross-functional leadership in process improvements.

The candidate will lead SPC/DOE initiatives, resolve process issues, and provide training to engineers in a fast-paced wafer/panel production environment.

Qualifications

• Bachelor-level degree required in Materials Science, Microelectronics, Chemical Engineering or similar.
• Hands-on wet etch and plating experience in Wafer-level Fanout packaging or LCD/FPD production lines.
• Experience in process engineering, process control engineering and yield enhancement.
• Experience in leading teams within a process area.
• Familiar with SPC, DOE, FEMA, and 8D reports.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production for wet etch.
• Establish, review and update specs, workflow, quality and safety docs for production line.
• Troubleshoot process issues and improve yield and cycle time from NPI to production.
• Lead SPC control towards zero defects; update FMEA and OCAP with cross-functional teams.
• Coordinate with stakeholders on process or quality issues.
• Provide training and guidance to engineers and act as main contact for process matters.

Skills

Wet etch

Plating

Process engineering

Education

Bachelor's degree in Materials Science, Microelectronics, Chemical Engineering or equivalent

Job description

Member of Technical Staff, Process (Wet) is responsible for development and establishment of production process.

Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line for wet etch process.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with stakeholders on process issue or quality issue.
• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Support NPI activities such as:New material, process & machine development and qualification.
• Handle and manage audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Provide training and guidance to engineers
• Main contact for process-related matters in the assigned process area
• Other ad-hoc duties as assigned

Requirements

• Minimum bachelor’s degree in Materials Science, Microelectronics, Chemical Engineering or similar disciplines
• Minimum 8-years hands-on wet etch and plating process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line
• Experience in process engineering, process control engineering and yield enhancement
• Experience in overseeing and lead team in assigned process area
• Experience in SPC, DOE, FEMA, and 8D reports