Process Engineer / Senior Engineer (Lithography)

SILICON BOX; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

SILICON BOX is seeking a Process Engineer (Front and Back End) to drive development and establishment of production processes. You will review machine buyoffs, transfer pilot lines to production, and create robust process documentation to sustain quality and efficiency.

Ideal candidates have at least 3 years hands‑on process experience in Wafer‑level Fanout packaging or LCD/FPD lithography, with practical knowledge of SPC, DOE, FEMA, and 8D reporting.

Qualifications

• Knowledge in process engineering, process control and yield enhancement.
• Hands‑on experience in Wafer‑level Fanout packaging or LCD/FPD lithography.
• Experience with SPC, DOE, FEMA, and 8D reports.

Responsibilities

• Review and accept machine buyoff and transfer from pilot to production line.
• Establish and update process specifications, workflow, quality and safety docs.
• Troubleshoot process issues to improve yield and cycle time from NPI to production.
• Lead SPC control and drive towards zero defects; review FMEA and control plans with cross‑functional teams.
• Coordinate with vendors on process or quality issues.
• Support customer NPI activities and internal engineering tasks.
• Develop and qualify new materials, processes and machines.
• Handle customer audits and 8D reports; provide disposition for lots.
• Conduct process characterization and establish process baseline.

Skills

Process engineering

Process control engineering

Yield enhancement

Job description

Process Engineer (Front and Back End) is responsible for development and establishment of production process.

Key Responsibilities

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis. Lead and drive SPC control towards zero defects. Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.

Requirement

• Knowledge in process engineering, process control engineering and yield enhancement.
• At least 3-years hands‑on process experience in area of in the Wafer‑level Fanout packaging production line or LCD/FPD production line in Lithography.
• Experience in SPC, DOE, FEMA, and 8D reports