Process Engineer - Poly Etch

STMICROELECTRONICS PTE LTD; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

STMicroelectronics Pte Ltd is seeking a Process Engineer to manage trench etch processes within the poly team and provide engineering support to the production line. You will own engineering issues, maintain real-time problem analysis, and implement effective solutions to ensure smooth process flow, high yield, and low cost.

The role requires a Bachelor’s degree in a related engineering field and around 2 years of experience with etch processes, with a focus on SPC/OOC/OOS, FDC failures, and

Qualifications

• Experience with wafer fabrication etch processes and trench etch operations.
• Ability to conduct real-time problem analysis for SPC/OOC/OOS and FDC failures.
• Set up process recipes for new processes and drive process stability.

Responsibilities

• Manage a cost-effective wafer fabrication process and own engineering issues for the assigned process.
• Support day-to-day manufacturing activities with real-time problem analysis and timely solutions.
• Ensure high quality, high yield, and low cost by collaborating with Maintenance, Production Supervisors, and Shift Engineers.

Skills

Etch processes

SPC OOC/OOS

FDC failures

Process control

Real-time analysis

Cross-functional teamwork

Education

Bachelor’s degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or related

Job description

YOUR ROLE

• Manage a cost-effective wafer fabrication process by providing engineering support to the production line to achieve the organization’s targeted manufacturing performance. Take full ownership of all engineering issues for the assigned process.
• Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely implementation of effective solutions.
• Ensure smooth process flow withhigh quality, high yield, and low costby working closely with Maintenance Specialists, Production Supervisors, and Shift Engineers to achieve committed targets.
• Provide cross-functional, cross-department, and cross-fab support based on operational needs and priorities.
• Train new engineers and share technical knowledge to support team development.
• Support shift operations as needed and return to normal shift assignment for process/project work when assigned.
• Take responsibility fortrench etch processes within the poly team.

YOUR SKILLS & EXPERIENCES

• Bachelor’s degree inElectrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or a related discipline.
• Around 2 years of experience with etch processes
• Experience in profile control and process stability.
• Ability to conduct real-time problem analysis forSPC OOC/OOS, defect failures, andFDC failures, and determine appropriate solutions by working with all relevant stakeholders.
• Ensure all basic inline investigations are reported in real time to the relevant owners with complete and accurate details.
• Ability to set up process recipes for newly introduced processes.
• Ability to establish a robust process control system to maintain thelowest possible Wafer at Risk (WAR)level, maximize thesignal-to-noise ratiofor SPC and FDC, and minimize human dependency.