Memory Process Pathfinding Lead — Advanced NAND R&D

CHARTERHOUSE PTE. LTD.

Singapore

Sur place

SGD 120 000 - 180 000

Plein temps

Il y a 4 jours
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Résumé du poste

Charterhouse PTE. LTD. seeks an experienced Senior Plasma Etch Engineer for advanced memory R&D in Singapore.

You will lead the dry etch roadmap for next-generation NAND, and drive plasma chemistry, process equipment capabilities, and toolbox improvements across cross-disciplinary teams. You will apply data analytics, AI/ML and predictive modelling to speed up learning curves and optimize etch performance while coordinating with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography,

Qualifications

  • Hands-on ICP and/or CCP plasma etch experience in semiconductor process development.
  • Strong grasp of plasma-surface interactions, etch chemistry, profile control and etch equipment.
  • Foundation in plasma physics, materials interactions and process integration.
  • Experience refining dry etch processes for advanced technologies.

Responsabilités

  • Lead the dry etch process roadmap for next-generation NAND, meeting structural, electrical and yield targets.
  • Develop new plasma chemistries, processes and equipment capabilities for future nodes.
  • Manage new, high-performance dry etch chambers.
  • Use data analytics, AI/ML and predictive modelling to speed up process learning and improve etch performance.
  • Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams.

Connaissances

ICP/CCP etch
plasma etch
data analytics
team collaboration

Formation

PhD or MS with 7–10 years in dry etch/process development

Description du poste

Charterhouse PTE. LTD. seeks an experienced Senior Plasma Etch Engineer for advanced memory R&D in Singapore.

You will lead the dry etch roadmap for next-generation NAND, and drive plasma chemistry, process equipment capabilities, and toolbox improvements across cross-disciplinary teams. You will apply data analytics, AI/ML and predictive modelling to speed up learning curves and optimize etch performance while coordinating with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography,

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