Principal Engineer – Memory Process Pathfinding

Charterhouse SG; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Charterhouse Asia in Singapore is seeking a senior dry etch process engineer to lead roadmap development for next‑gen NAND devices. You will advance plasma chemistries, manage high‑performance etch chambers and apply AI/ML to speed process learning.

Candidate should have hands‑on ICP/CCP etch experience, a solid foundation in plasma physics and strong collaboration across Process Integration and device teams.

Qualifications

• Hands-on ICP and/or CCP plasma etch experience in semiconductor process development.
• Strong grasp of plasma-surface interactions, etch chemistry, profile control and etch equipment.
• Foundation in plasma physics, materials interactions and process integration.
• Experience developing and refining dry etch processes for advanced technologies.
• Familiarity with statistical analysis and process optimisation.
• Ability to work across multidisciplinary teams.

Responsibilities

• Lead the dry etch process roadmap for next-generation NAND, meeting structural, electrical and yield targets.
• Develop new plasma chemistries, processes and equipment capabilities for future nodes.
• Manage new, high-performance dry etch chambers.
• Use data analytics, AI/ML and predictive modelling to speed up process learning and improve etch performance.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams.

Skills

ICP/CCP plasma etch

Plasma-surface interactions

Etch chemistry

Profile control

Etch equipment

Plasma physics

Materials interactions

Process integration

Dry etch development

Statistical analysis

Process optimization

Cross-functional collaboration

Education

PhD or MS with 7–10 years in dry etch or process development

Job description

This is a chance to do advanced memory R&D at one of Singapore’s most recognised semiconductor sites. The site’s current fab was the first front-end fab in the world to be recognised by the World Economic Forum as both an Advanced Fourth Industrial Revolution Lighthouse and a Sustainability Lighthouse. The company is also investing about US$7 billion in a new HBM advanced packaging facility, the first of its kind in Singapore, and its future Singapore expansion plans will also support long-term NAND manufacturing.

RESPONSIBILITIES:

• Lead the dry etch process roadmap for next-generation NAND, meeting structural, electrical and yield targets

• Develop new plasma chemistries, processes and equipment capabilities for future nodes

• Manage new, high-performance dry etch chambers

• Use data analytics, AI/ML and predictive modelling to speed up process learning and improve etch performance

• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams

REQUIREMENTS:

• Hands-on ICP and/or CCP plasma etch experience in semiconductor process development

• Strong grasp of plasma-surface interactions, etch chemistry, profile control and etch equipment

• Foundation in plasma physics, materials interactions and process integration

• Experience developing and refining dry etch processes for advanced technologies

• Familiarity with statistical analysis and process optimisation

• Ability to work across multidisciplinary teams

Preferred

• PhD or MS with 7 to 10 years in dry etch or process development

• High aspect ratio (HAR) etch, pattern transfer, selective etch

• ML, predictive or virtual process modelling applied to technology development

• Autonomy in a fast-moving R&D setting, strong communication skills

• Mentoring or technical project leadership

EA License no: 16S8066 | Reg no.: R1767184

Only successful candidates will be notified.