Memory Process Pathfinding Lead — Advanced Plasma Etch & AI

Charterhouse Asia; Singapore; Sur place; SGD 120 000 - 180 000; Plein temps

Résumé du poste

Charterhouse Asia in Singapore is seeking a senior dry etch process engineer to lead roadmap development for next‑gen NAND devices. You will advance plasma chemistries, manage high‑performance etch chambers and apply AI/ML to speed process learning.

Candidate should have hands‑on ICP/CCP etch experience, a solid foundation in plasma physics and strong collaboration across Process Integration and device teams.

Qualifications

• Hands-on ICP and/or CCP plasma etch experience in semiconductor process development.
• Strong grasp of plasma-surface interactions, etch chemistry, profile control and etch equipment.
• Foundation in plasma physics, materials interactions and process integration.
• Experience developing and refining dry etch processes for advanced technologies.
• Familiarity with statistical analysis and process optimisation.
• Ability to work across multidisciplinary teams.

Responsabilités

• Lead the dry etch process roadmap for next-generation NAND, meeting structural, electrical and yield targets.
• Develop new plasma chemistries, processes and equipment capabilities for future nodes.
• Manage new, high-performance dry etch chambers.
• Use data analytics, AI/ML and predictive modelling to speed up process learning and improve etch performance.
• Work closely with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP and Device teams.

Connaissances

ICP/CCP plasma etch

Plasma-surface interactions

Etch chemistry

Profile control

Etch equipment

Plasma physics

Materials interactions

Process integration

Dry etch development

Statistical analysis

Process optimization

Cross-functional collaboration

Formation

PhD or MS with 7–10 years in dry etch or process development

Description du poste

Charterhouse Asia in Singapore is seeking a senior dry etch process engineer to lead roadmap development for next‑gen NAND devices. You will advance plasma chemistries, manage high‑performance etch chambers and apply AI/ML to speed process learning.

Candidate should have hands‑on ICP/CCP etch experience, a solid foundation in plasma physics and strong collaboration across Process Integration and device teams.